Paper
13 July 2017 Model-based MPC enables curvilinear ILT using either VSB or multi-beam mask writers
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Abstract
Inverse Lithography Technology (ILT) is becoming the choice for Optical Proximity Correction (OPC) of advanced technology nodes in IC design and production. Multi-beam mask writers promise significant mask writing time reduction for complex ILT style masks. Before multi-beam mask writers become the main stream working tools in mask production, VSB writers will continue to be the tool of choice to write both curvilinear ILT and Manhattanized ILT masks. To enable VSB mask writers for complex ILT style masks, model-based mask process correction (MB-MPC) is required to do the following: 1). Make reasonable corrections for complex edges for those features that exhibit relatively large deviations from both curvilinear ILT and Manhattanized ILT designs. 2). Control and manage both Edge Placement Errors (EPE) and shot count. 3. Assist in easing the migration to future multi-beam mask writer and serve as an effective backup solution during the transition. In this paper, a solution meeting all those requirements, MB-MPC with GPU acceleration, will be presented. One model calibration per process allows accurate correction regardless of the target mask writer.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Linyong Pang, Yutetsu Takatsukasa, Daisuke Hara, Michael Pomerantsev, Bo Su, and Aki Fujimura "Model-based MPC enables curvilinear ILT using either VSB or multi-beam mask writers", Proc. SPIE 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology, 1045407 (13 July 2017); https://doi.org/10.1117/12.2281110
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KEYWORDS
Photomasks

Process modeling

Lithography

Model-based design

Etching

Optical proximity correction

Convolution

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