24 October 2017 Study on VCSEL laser heating chip in nuclear magnetic resonance gyroscope
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Proceedings Volume 10457, AOPC 2017: Laser Components, Systems, and Applications; 104572O (2017) https://doi.org/10.1117/12.2284919
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China
Abstract
In recent years, atomic gyroscope has become an important direction of inertial navigation. Nuclear magnetic resonance gyroscope has a stronger advantage in the miniaturization of the size. In atomic gyroscope, the lasers are indispensable devices which has an important effect on the improvement of the gyroscope performance. The frequency stability of the VCSEL lasers requires high precision control of temperature. However, the heating current of the laser will definitely bring in the magnetic field, and the sensitive device, alkali vapor cell, is very sensitive to the magnetic field, so that the metal pattern of the heating chip should be designed ingeniously to eliminate the magnetic field introduced by the heating current. In this paper, a heating chip was fabricated by MEMS process, i.e. depositing platinum on semiconductor substrates. Platinum has long been considered as a good resistance material used for measuring temperature The VCSEL laser chip is fixed in the center of the heating chip. The thermometer resistor measures the temperature of the heating chip, which can be considered as the same temperature of the VCSEL laser chip, by turning the temperature signal into voltage signal. The FPGA chip is used as a micro controller, and combined with PID control algorithm constitute a closed loop control circuit. The voltage applied to the heating resistor wire is modified to achieve the temperature control of the VCSEL laser. In this way, the laser frequency can be controlled stably and easily. Ultimately, the temperature stability can be achieved better than 100mK.
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Xiaoyang Liang, Binquan Zhou, Wenfeng Wu, Yuchen Jia, Jing Wang, "Study on VCSEL laser heating chip in nuclear magnetic resonance gyroscope", Proc. SPIE 10457, AOPC 2017: Laser Components, Systems, and Applications, 104572O (24 October 2017); doi: 10.1117/12.2284919; https://doi.org/10.1117/12.2284919
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