24 October 2017 Design of high precision temperature control system for TO packaged LD
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Proceedings Volume 10458, AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing; 104581Y (2017) https://doi.org/10.1117/12.2283461
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China
Abstract
Temperature is an important factor affecting the performance of TO package LD. In order to ensure the safe and stable operation of LD, a temperature control circuit for LD based on PID technology is designed. The MAX1978 and an external PID circuit are used to form a control circuit that drives the thermoelectric cooler (TEC) to achieve control of temperature and the external load can be changed. The system circuit has low power consumption, high integration and high precision,and the circuit can achieve precise control of the LD temperature. Experiment results show that the circuit can achieve effective and stable control of the laser temperature.
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Enji Liang, Baoke Luo, Bin Zhuang, Zhengquan He, "Design of high precision temperature control system for TO packaged LD", Proc. SPIE 10458, AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, 104581Y (24 October 2017); doi: 10.1117/12.2283461; https://doi.org/10.1117/12.2283461
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