24 October 2017 Design of 1024x3 ROIC with TDI for scanning type IRFPA imaging
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Proceedings Volume 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications; 104620W (2017) https://doi.org/10.1117/12.2282932
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China
Abstract
Design of a multispectral infrared focal plane array ROIC (readout integrated circuit) with TDI (time delay integration) is presented. A 3 SNR improvement can be achieved by a 3 pixels TDI implementation. The 3 pixel signals in each channel are firstly integrated by 3 CTIA structures, then the TDI action is in SC-AMP (switch capacitor amplifier) of each channel. A novel switch capacitor amplifier topology is proposed which can both reduce power dissipation by shutting down the AMP and realize offset voltage cancellation. Besides, bad pixel replacement is realized by an alternative gain of the SC-AMP. The proposed ROIC can work well both room and cryogenic temperature. Simulation results show that the CTIA input stage have a good linearity of 99.721% (post-layout sim) over 2.8V output span.
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Gongyuan Zhao, Gongyuan Zhao, Mao Ye, Mao Ye, Kai Hu, Kai Hu, Yiqiang Zhao, Yiqiang Zhao, } "Design of 1024x3 ROIC with TDI for scanning type IRFPA imaging", Proc. SPIE 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 104620W (24 October 2017); doi: 10.1117/12.2282932; https://doi.org/10.1117/12.2282932
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