24 October 2017 Automated and standardized high-resolution appearance imaging system for electronic components
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Proceedings Volume 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications; 104623N (2017) https://doi.org/10.1117/12.2285189
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China
Abstract
The rapid development of electronic industry not only increases the variety of electronic components, but also increases the difficulty of inspection work. To effectively improve the appearance inspection performance, an appearance imaging system based on machine vision is proposed in this paper. The system provides practical solutions for the following four problems. Firstly, to maintain the consistence of appearance images, a standardized imaging method is presented to unify imaging parameters. Secondly, when dealing with different reflection properties, we proposed a combined illumination method using light sources with different wave lengths to meet imaging needs. Thirdly, for large size objects, we put forward a method combined with size measurement and image mosaic to get high-resolution and panoramic images. Fourthly, this paper provides a method of 3D reconstruction based on monocular vision to reflect depth information and geometric characteristics of real scenes. In the meanwhile, we design associated software to achieve the auto-control. Experiment results conclude that it is effective to achieve standardized and high-resolution appearance imaging. The system builds up a good foundation for the subsequent inspection work. The research of this paper has a broad meaning and application prospect.
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Yunhe Liu, Yunhe Liu, Ke Wang, Ke Wang, Jiyuan Liang, Jiyuan Liang, Junzhang Chen, Junzhang Chen, Xiangzhi Bai, Xiangzhi Bai, Fugen Zhou, Fugen Zhou, } "Automated and standardized high-resolution appearance imaging system for electronic components", Proc. SPIE 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 104623N (24 October 2017); doi: 10.1117/12.2285189; https://doi.org/10.1117/12.2285189
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