24 October 2017 An introduction of resistive arrays and packaging technology
Author Affiliations +
Proceedings Volume 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications; 104624G (2017) https://doi.org/10.1117/12.2285546
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China
Abstract
As an important way to simulate the dynamic infrared scene, the technology of resistive arrays, especially large format resistive arrays are developing very fast. Principle of resistive arrays is introduced. The unit cell is composed by two MOS transistors, a capacitor and a resistor. The resistor is the main element to make infrared radiation by heating. Key parameters, such as temperature, frame rate, uniformity and cross-talk are used to standard to evaluate the performance of the arrays. Several methods to improve the parameters is put forward. In addition, development and current situation of the packaging technology is discussed and analyzed in this paper. At last, the technology developments of resistive arrays and packaging are summed up and an outlook of the future is provided.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Quan Sun, Quan Sun, Dafu Liu, Dafu Liu, Haimei Gong, Haimei Gong, } "An introduction of resistive arrays and packaging technology", Proc. SPIE 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 104624G (24 October 2017); doi: 10.1117/12.2285546; https://doi.org/10.1117/12.2285546
PROCEEDINGS
6 PAGES


SHARE
Back to Top