Translator Disclaimer
14 March 2018 Characterization of individualized assembly for BFL-compensated FAC on bottom tab modules (Conference Presentation)
Author Affiliations +
Proceedings Volume 10514, High-Power Diode Laser Technology XVI; 1051410 (2018)
Event: SPIE LASE, 2018, San Francisco, California, United States
Uncertain glue gaps lead to challenging assembly tasks in respect to shrinkage control. With decreasing back-focal lengths (BFL) in collimators, the tolerance window for correct alignments decreases as well and forces manufactures to find novel approaches to realize the bonding process. We present performance characteristics of an automated assembly cell for individualized FAC on bottom tab modules. BFL-compensated collimators allow minimizing the critical adhesive gap between substrate and diode laser. This provides optimal control over shrinkage, as well as thermal aspects of the bonding properties. We will focus on the active alignment, which provides the individual focus distance, as well as the relative image processing necessary to assemble both components with ±1 µm precision. Our machine concept and measurement equipment is suitable as stand-alone process for optic manufacturers, as well as integrated part in the final application assembly. In last year’s publication (SPIE 10086), we presented the general concept and can now support our approach with more details from our operating data. With minimized adhesive gaps, the robustness of the proposed concept and a precise characterization of its process window is key, as minimal variations lead to rejects and cause high costs during the final application assembly. Besides classic properties, many more characteristics, e.g. smile behavior of the optic module, are potential optimization factors to increase beam quality. Characterization data from both optic and laser allow applying tolerance matching, where alignment is physically constraint. Performance wise, we will discuss the repeatability, achievable precision and the implications on process time.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel Zontar, Tobias Müller, Sebastian Sauer, Christoph Baum, and Christian Brecher "Characterization of individualized assembly for BFL-compensated FAC on bottom tab modules (Conference Presentation)", Proc. SPIE 10514, High-Power Diode Laser Technology XVI, 1051410 (14 March 2018);


Handling and mounting of micro-optical components
Proceedings of SPIE (August 19 1996)
Changes In Manufacturing, Testing And Process Control
Proceedings of SPIE (October 04 1979)
Sensor-controlled optical assembling
Proceedings of SPIE (August 01 1990)
High duty cycle hard soldered kilowatt laser diode arrays
Proceedings of SPIE (February 17 2010)

Back to Top