Proceedings Volume 10519 is from: Logo
27 January - 1 February 2018
San Francisco, California, United States
Front Matter: Volume 10519
Proc. SPIE 10519, Front Matter: Volume 10519, 1051901 (23 May 2018);
Industrial Applications I: Processes and Applications
Proc. SPIE 10519, Ultrafast laser ablation of copper with ~GHz bursts, 1051902 (16 February 2018);
Proc. SPIE 10519, Machining of semiconductors and dielectrics with ultra-short pulses: Influence of the wavelength and pulse bursts (Conference Presentation), 1051904 ();
Proc. SPIE 10519, Micromachining using pulse bursts: influence of the pulse duration and the number of pulses in the burst on the specific removal rate, 1051905 (16 February 2018);
Proc. SPIE 10519, Advanced welding of transparent materials by ultrashort laser pulses, 1051906 (16 February 2018);
Industrial Applications II: Towards Digital Photonics Production
Proc. SPIE 10519, Beam delivery methods for highly efficient USP-laser micro structuring of large cylindrical surfaces for printing and embossing, 1051908 (16 February 2018);
Proc. SPIE 10519, Correlation between ablation efficiency, surface morphology, and multipass capability using a 100-W 10-MHz ultrafast laser, 1051909 (16 February 2018);
Proc. SPIE 10519, Ultra-short pulse fiber beam delivery in micromachining applications, 105190A (20 February 2018);
Diagnostics and its Applications
Proc. SPIE 10519, Development of a tunable high repetition rate XUV source for time-resolved photoemission studies of ultrafast dynamics at surfaces, 105190B (16 February 2018);
Proc. SPIE 10519, Advanced in-situ diagnostics of ultra short pulsed micromachining in glass, 105190C (16 February 2018);
Proc. SPIE 10519, Using a camera feedback loop for phase retrieval in an iterative Fourier transform algorithm to calculate beam splitter phase gratings for parallel laser microstructuring (Conference Presentation), 105190D ();
Thin Film and Wafer Processing
Proc. SPIE 10519, Laser processing of CZTS thin-films for photovoltaic applications (Conference Presentation), 105190F ();
Proc. SPIE 10519, Electrical micro-heating structures on glass created by laser ablation, 105190G (16 February 2018);
Proc. SPIE 10519, Tunable laser diode using partially intermixed InGaAsP multiple quantum well, 105190H (16 February 2018);
Laser Direct Writing I
Proc. SPIE 10519, Digital laser printing at the nanoscale (Conference Presentation), 105190I ();
Proc. SPIE 10519, Breaking the ultrafast breakdown barrier in bulk silicon (Conference Presentation), 105190J ();
Proc. SPIE 10519, Femtosecond written buried waveguides in silicon, 105190K (16 February 2018);
Proc. SPIE 10519, Controlling properties of few-layer MoS2 with a multi-laser process scheme, 105190L (16 February 2018);
Laser Direct Writing II
Proc. SPIE 10519, Multiple-pulse effects during printing of silver paste using laser induced forward transfer (Conference Presentation), 105190N ();
Proc. SPIE 10519, Laser-induced forward transfer with optical stamp for high-quality film printing (Conference Presentation), 105190O ();
Fundamental Aspects of Laser-Materials Interaction
Proc. SPIE 10519, Relaxation processes in laser-excited dielectrics, 105190P (16 February 2018);
Proc. SPIE 10519, Nonequilibrium optical response of metals irradiated by ultrafast laser pulses (Conference Presentation), 105190S ();
Proc. SPIE 10519, Electron dynamics in silver after ultrafast laser-excitation, 105190T (16 February 2018);
Laser-induced Modification of Glasses or Transparent Materials
Proc. SPIE 10519, Investigation of femtosecond laser written waveguide refractive index change in toughened glass: Towards integration of photonics device inside cellphone screens (Conference Presentation), 105190U ();
Proc. SPIE 10519, Direct laser writing of double track waveguides inside calcium fluoride crystals (Conference Presentation), 105190V ();
Proc. SPIE 10519, Asymmetrical Bessel-Gaussian beams for fast glass cutting (Conference Presentation), 105190W ();
Proc. SPIE 10519, Microfabrication of PDMS structures based on wave optics using EUV radiations from laser-produced plasma (Conference Presentation), 105190X ();
Proc. SPIE 10519, Laser processing transparent materials with nanosecond, picosecond and femtosecond pulses for industrial applications , 105190Y (16 February 2018);
3D Manufacturing in Micro- and Nanoscale
Proc. SPIE 10519, 3D laser nano-printing for bio-scaffolds and metamaterials (Conference Presentation), 1051910 ();
Proc. SPIE 10519, Numerical modeling of multi-photon polymerization by ultrafast laser (Conference Presentation), 1051911 ();
Proc. SPIE 10519, Femtosecond laser based micro/nano-additive manufacturing (Conference Presentation), 1051912 ();
Laser Nanoscale Materials Processing and Manufacturing
Proc. SPIE 10519, Simple fabrication of semiconductor microspheres by laser ablation in air (Conference Presentation), 1051914 ();
Proc. SPIE 10519, Fabrication of hollow microneedles by optical vortex illumination, 1051915 (16 February 2018);
Proc. SPIE 10519, Fabrication of transparent flexible electrodes by laser-assisted processing of flash light sintered gold nanoparticles on a polycarbonate filter membrane (Conference Presentation), 1051917 ();
Proc. SPIE 10519, SERS microchips integrated with 2D periodic Cu-Ag SERS nanostructure inside a 3D microfluidics by all-femtosecond-laser-processing, 1051918 (16 February 2018);
Poster Session
Proc. SPIE 10519, Microfabrication of UV transparent fluoric polymer using a conventional pulsed green laser, 1051919 (16 February 2018);
Proc. SPIE 10519, Femtosecond laser induced periodic nanostructures formation on medical polymer plate surface for control of cell spreading, 105191A (16 February 2018);
Proc. SPIE 10519, Femtosecond laser-written double line waveguides in germanate and tellurite glasses, 105191B (16 February 2018);
Proc. SPIE 10519, Simultaneous measurement of surface profile and thickness variation of transparent parallel plate using wavelength tuning Fizeau interferometer, 105191D (16 February 2018);
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