Ultrafast laser ablation of copper with ~GHz bursts

Hisashi Matsumoto; Zhibin Lin; Jan Kleinert

doi:10.1117/12.2294041

16 February 2018 Ultrafast laser ablation of copper with ~GHz bursts

Hisashi Matsumoto, Zhibin Lin, Jan Kleinert

Proceedings Volume 10519, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIII; 1051902 (2018) https://doi.org/10.1117/12.2294041
Event: SPIE LASE, 2018, San Francisco, California, United States

Abstract

The recently reported copper ablation study using ultrafast IR lasers with unusually high burst repetition rates (∼ GHz) that claims “an order of magnitude” efficiency enhancement compared to non-burst processes due to “ablation cooling” warrants further investigation both experimentally and through modeling the process. We experimentally reproduce a subset of these results, compare it to the known best non-burst pulse results, and find that within our experimentally accessible parameter range, there is indeed an up to ∼ 3.5x benefit when punching (i.e. drilling holes) with 864 MHz pulse bursts. However, this efficiency increase does not translate from punching to milling (machining an area), which we find to be less than half as efficient as an optimized non-burst process, while also delivering worse process quality. We conclude that a hydrodynamic picture is needed to understand the discrepancy between punching and milling efficiency for a ∼ GHz burst process.

Citation Download Citation

Hisashi Matsumoto, Zhibin Lin, and Jan Kleinert "Ultrafast laser ablation of copper with ~GHz bursts", Proc. SPIE 10519, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIII, 1051902 (16 February 2018); https://doi.org/10.1117/12.2294041

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