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14 March 2018 Breaking the ultrafast breakdown barrier in bulk silicon (Conference Presentation)
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Abstract
INVITED (by Beat Neuenschwander) An important challenge in the field of three-dimensional ultrafast laser processing is to achieve in the bulk structuring of silicon and narrow gap materials. Attempts by increasing the energy of infrared ultrashort pulses have simply failed. Our solution is inspired by solid-immersion microscopy to produce hyper-focused beams which are intrinsically free from aberrations and associated with an extreme energy confinement deep into the matter. Its validity is demonstrated by controlled refractive index modifications inside silicon. This opens a way to the direct writing of 3D monolithic devices for silicon photonics and provides perspectives for new strong-field physics and warm-dense-matter experiments.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Grojo "Breaking the ultrafast breakdown barrier in bulk silicon (Conference Presentation)", Proc. SPIE 10519, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIII, 105190J (14 March 2018); https://doi.org/10.1117/12.2291473
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