Front Matter: Volume 10520
Proc. SPIE 10520, Front Matter: Volume 10520, 1052001 (24 May 2018); doi: 10.1117/12.2322787
Laser Micro Structuring and Processing I
Proc. SPIE 10520, New laser slicing technology named KABRA process enables high speed and high efficiency SiC slicing, 1052003 (19 February 2018); doi: 10.1117/12.2291458
Proc. SPIE 10520, Stealth Dicing technology with SWIR laser realizing high throughput Si wafer dicing, 1052004 (19 February 2018); doi: 10.1117/12.2289235
Proc. SPIE 10520, Laser ablation of silicon wafers: New findings, new insights (Conference Presentation), 1052005 (14 March 2018); doi: 10.1117/12.2285191
Proc. SPIE 10520, Femtosecond laser direct writing of Cu-based fine patterns using Cu2O nanospheres, 1052006 (19 February 2018); doi: 10.1117/12.2287686
Laser Micro Structuring and Processing II
Proc. SPIE 10520, Direct laser writing of 3D microfluidic structures in glass for lab-on-a-chip applications, 1052007 (19 February 2018); doi: 10.1117/12.2286564
Proc. SPIE 10520, Application of 400-W laser MicroJet for high-throughput and low-Impact micro-structuring of aerospace and tooling industry parts (Conference Presentation), 1052008 (14 March 2018); doi: 10.1117/12.2295712
Proc. SPIE 10520, Incubation effect in burst mode fs-laser ablation of stainless steel samples, 105200A (19 February 2018); doi: 10.1117/12.2291612
Laser Micro/Nano Structuring on Flexible Substrates
Proc. SPIE 10520, Laser microstructured diamond electrode arrays for bionic eye applications (Conference Presentation), 105200B (14 March 2018); doi: 10.1117/12.2295786
Proc. SPIE 10520, Nanoablation of Si surface with femtosecond-laser-induced plasmonic near-fields, 105200C (19 February 2018); doi: 10.1117/12.2293097
Proc. SPIE 10520, Direct observation of internal void formations in Stealth Dicing, 105200D (19 February 2018); doi: 10.1117/12.2288238
Proc. SPIE 10520, Solvent induced reversible deformations of polymeric 3D microstructures for actuation and sensing applications, 105200E (19 February 2018); doi: 10.1117/12.2288792
Proc. SPIE 10520, Flexible and stretchable micro GO/rGO optical structures by femtosecond laser photoreduction, 105200F (19 February 2018); doi: 10.1117/12.2289671
High-speed Laser Beam Engineering Systems for High-power, Ultrashort Pulsed Lasers
Proc. SPIE 10520, Ultrafast dynamics of material excitation of dielectrics with ultrashort pulsed Bessel beams, 105200G (19 February 2018); doi: 10.1117/12.2287337
Proc. SPIE 10520, Ultrafast z-scanning for high efficiency laser material processing (Conference Presentation), 105200H (14 March 2018); doi: 10.1117/12.2287914
Proc. SPIE 10520, Parallel processing of embossing dies with ultrafast lasers, 105200I (19 February 2018); doi: 10.1117/12.2288278
Large-area Micro/Nano Structuring and Laser Interference Patterning
Proc. SPIE 10520, R2R fabrication of freeform micro-optics (Conference Presentation), 105200J (14 March 2018); doi: 10.1117/12.2295784
Proc. SPIE 10520, Optimization for high speed surface processing of metallic surfaces utilizing direct laser interference patterning, 105200K (19 February 2018); doi: 10.1117/12.2290320
Proc. SPIE 10520, 2D laser induced periodic surface structures with double cross-polarized pulses, 105200L (19 February 2018); doi: 10.1117/12.2287841
Proc. SPIE 10520, Double pulse explosion drilling of transparent materials, 105200M (19 February 2018); doi: 10.1117/12.2287648
Direct-write Processing, Ablation, and Surface Modification I
Proc. SPIE 10520, Applications of ultrafast laser direct writing: from polarization control to data storage , 105200N (19 February 2018); doi: 10.1117/12.2291506
Proc. SPIE 10520, Laser direct writing of biocompatible hydrogels using a blister assisted approach with thick polyimide layers (Conference Presentation), 105200O (14 March 2018); doi: 10.1117/12.2283081
Proc. SPIE 10520, Laser direct writing of reduced graphene oxide micropatterns and sensor applications, 105200P (19 February 2018); doi: 10.1117/12.2288355
Laser Micro/Nano Structuring on Metals
Proc. SPIE 10520, High repetition frequency micro hole drilling of metal foils using ultrashort pulse laser radiation, 105200R (19 February 2018); doi: 10.1117/12.2289853
Proc. SPIE 10520, Characteristics of micro-holes drilled in ambient air and vacuum by high-power Nd:YAG laser, 105200S (19 February 2018); doi: 10.1117/12.2289954
Proc. SPIE 10520, Drilling progress of deep holes in tool steel using high energy picosecond laser pulses (Conference Presentation), 105200T (14 March 2018); doi: 10.1117/12.2290852
Proc. SPIE 10520, Formation of two-way shape memory effect in NiTi alloy using pulsed laser irradiation, 105200V (19 February 2018); doi: 10.1117/12.2290276
Proc. SPIE 10520, Development of AISI 316L stainless steel coronary stent, 105200W (19 February 2018); doi: 10.1117/12.2289971
Direct-write Processing, Ablation, and Surface Modification II
Proc. SPIE 10520, New fast galvo scanner head for high throughput micromachining, 105200X (19 February 2018); doi: 10.1117/12.2289739
Proc. SPIE 10520, Low energy sub-micron laser machining using photonic nanojet with shaped optical fiber tip (Conference Presentation), 105200Y (14 March 2018); doi: 10.1117/12.2291569
Proc. SPIE 10520, Microfabrication of curved sidewall grooves using scanning nanosecond excimer laser ablation, 105200Z (19 February 2018); doi: 10.1117/12.2286908
Proc. SPIE 10520, Model for ultrafast laser micromachining, 1052010 (19 February 2018); doi: 10.1117/12.2286250
Advanced 1D to 3D Subtractive and Additive Processes
Proc. SPIE 10520, Direct writing of three-dimensional Cu-based sensors using femtosecond laser reduction of CuO nanoparticles, 1052013 (19 February 2018); doi: 10.1117/12.2290166
Proc. SPIE 10520, Laser printing and sintering of Zn nanoparticles for bioresorbable electronics (Conference Presentation), 1052014 (14 March 2018); doi: 10.1117/12.2291280
Advanced Laser Structuring for Energy Storage and Conversion I
Proc. SPIE 10520, Laser in battery manufacturing: impact of intrinsic and artificial electrode porosity on chemical degradation and battery lifetime, 1052017 (19 February 2018); doi: 10.1117/12.2288440
Advanced Laser Structuring for Energy Storage and Conversion II
Proc. SPIE 10520, Laser micro-spot welding of AISI 302 stainless steel sheets, 1052018 (19 February 2018); doi: 10.1117/12.2290003
Proc. SPIE 10520, Modeling of a VMJ PV array under Gaussian high intensity laser power beam condition, 1052019 (19 February 2018); doi: 10.1117/12.2288737
Proc. SPIE 10520, Glass light pipes for solar concentration, 105201A (19 February 2018); doi: 10.1117/12.2291249
Poster Session
Proc. SPIE 10520, Laser interference lithography on non-planar surface for roll-to-roll process, 105201D (19 February 2018); doi: 10.1117/12.2288221
Proc. SPIE 10520, Improving piezo actuators for nanopositioning tasks, 105201E (19 February 2018); doi: 10.1117/12.2286894
Proc. SPIE 10520, Femtosecond laser-assisted etching: making arbitrary shaped 3D glass micro-structures, 105201G (19 February 2018); doi: 10.1117/12.2286906
Proc. SPIE 10520, Local temperature measurement during ultrafast laser 3D nanolithography writing, 105201I (16 March 2018); doi: 10.1117/12.2287826
Proc. SPIE 10520, Formation mechanism of self-assembled polarization-dependent periodic nanostructures in β-Ga2O3, 105201J (19 February 2018); doi: 10.1117/12.2288276
Proc. SPIE 10520, Nano- and micro-structuring of fused silica using time-delay adjustable double flash ns-laser radiation, 105201K (19 February 2018); doi: 10.1117/12.2288294
Proc. SPIE 10520, Durable superhydrophobic-superoleophilic copper mesh fabricated by pulsed laser ablation for oil/water separation, 105201M (19 February 2018); doi: 10.1117/12.2289212
Proc. SPIE 10520, Three-dimensional micro-nano-hierarchical porous structures based on the deposition of the ablated material by picosecond pulses, 105201N (19 February 2018); doi: 10.1117/12.2289613
Proc. SPIE 10520, Pulsed laser micro-scribing of copper thin films on polyimide substrate in NaCl solution, 105201O (19 February 2018); doi: 10.1117/12.2289724
Proc. SPIE 10520, Dynamics of thermally generated microbubbles, 105201S (19 February 2018); doi: 10.1117/12.2292069
Proc. SPIE 10520, Laser pre-exposure to mitigate damage on microparticle-contaminated fused silica surface in high power laser systems, 105201T (23 February 2018); doi: 10.1117/12.2293034
Proc. SPIE 10520, Optimization of femtosecond laser micromachining of polylactide and PLLA/HAp composite, 105201V (19 February 2018); doi: 10.1117/12.2296433
Proc. SPIE 10520, Degradation of poly(L-lactide) under femtosecond laser treatment, 105201W (19 February 2018); doi: 10.1117/12.2296531
Proc. SPIE 10520, Experimental investigation of texturing complex geometry using high repetition nano laser and comparison with the simulated COMSOL model, 105201X (19 February 2018); doi: 10.1117/12.2298770
Proc. SPIE 10520, Innovative approaches for coordinate extraction of curved shape and analyzing the effect of process parameters on the quality of the laser micro-machined surface, 105201Y (19 February 2018); doi: 10.1117/12.2299388