23 May 2018 Front Matter: Volume 10523
Proceedings Volume 10523, Laser 3D Manufacturing V; 1052301 (2018) https://doi.org/10.1117/12.2322862
Event: SPIE LASE, 2018, San Francisco, California, United States
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10523, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org. The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in Laser 3D Manufacturing V, edited by Henry Helvajian, Bo Gu, Alberto Piqué, Proceedings of SPIE Vol. 10523 (SPIE, Bellingham, WA, 2018) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510615311

ISBN: 9781510615328 (electronic)

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Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Abe, Nobuyuki, 0M, 1A

Angelastro, Andrea, 1B

Asano, K., 1A

Badr, Yasmine, 0B

Bean, Glenn E., 0Y

Böhm, M., 0K

Börret, R., 02

Brajer, J., 0K

Bristow, Douglas, 07

Buranasiri, P., 1C

Busetti, Bernhard, 05

Campanelli, Sabina L., 1B

Charipar, Kristin M., 0R

Charipar, Nicholas A., 0R

Chen, Ray T., 0T

Chen, Xiangfan, 0G

Deng, Andrew, 0B

Díaz-Rivera, Rubén E., 0R

Dong, Biqin, 0G

Emonts, Michael, 0E

Faidel, Dietrich, 19

Funada, Yoshinori, 0M, 1A

Gailevičius, Darius, 0X

Goldstein, Jonathan T., 07

Grishkanich, Aleksandr, 17

Grubb, Peter Mack, 0T

Gupta, Puneet, 0B

Hanada, Y., 0A

Heinrich, A., 02

Higashino, Ritsuko, 0M, 1A

Hostetler, John M., 07

Jaiyen, S., 1C

Janssen, Henning, 0E

Jonušauskas, Linas, 0X

Juodkazis, Saulius, 0X

Kaden, Lisa, 12

Kakovkina, Nina, 15

Kaufman, J., 0K

Kinzel, Edward C., 07

Koglbauer, Andreas, 16

Kolmakov, Egor, 17

Kramer, Reinhard, 16

Kudashev, Ilia, 17

Lachmayer, R., 0N

Landers, Robert, 07

Laskin, Alexander, 19

Laskin, Vadim, 19

Latte, Marco, 1B

Leuteritz, G., 0N

Li, Wentao, 0T

Limsuwan, P., 1C

Liu, Wenzhong, 0G

Lutzer, Bernhard, 05

Malinauskas, Mangirdas, 0X

Märten, Otto, 16

Matthäus, Gabor, 0C, 12

McLouth, Tait D., 0Y

Merkel, M., 02

Mocek, T., 0K

Mokhtari-Koushyar, Farzad, 0T

Nolte, Stefan, 0C, 12

O’Brien, Michael J., 0S

Palano, Fania, 1B

Piqué, Alberto, 0R

Ranusawud, A., 1C

Redka, Dmitriy, 17

Rekštytė, Sima, 0X

Riegel, H., 02

Rizzo, Antonella, 1B

Rostohar, D., 0K

Sakon, Yuu, 0M

Sato, Yuji, 0M, 1A

Schade, L., 0C

Scherbakov, Vladimir, 11, 15

Sengoku, M., 1A

Seyfarth, Brian, 0C, 12

Shishkovsky, Igor, 11, 15

Shobu, Takahisa, 0M, 1A

Stampfl, Jürgen, 05

Stollenwerk, Jochen, 0E

Striet, Philipp, 0E

Sun, Cheng, 0G

Thongsuwan, S., 1C

Tsukamoto, Masahiro, 0M, 1A

Tsvetkov, Konstantin, 17

Tünnermann, A., 0C

Ullsperger, Tobias, 0C, 12

Utley, Eric, 10

Voell, Annika, 0E

Ware, Henry Oliver T., 0G

Weiler, Thomas, 0E

Witkin, David B., 0Y

Wolf, Stefan, 16

Yamashita, Yorihiro, 0M

Yoshida, M., 1A

Zaldivar, Rafael J., 0Y

Zhang, Hao F., 0G

Zulić, S., 0K

Conference Committee

Symposium Chairs

  • Koji Sugioka, RIKEN (Japan)

  • Reinhart Poprawe, Fraunhofer-Institut für Lasertechnik (Germany)

Symposium Co-chairs

  • Xianfan Xu, Purdue University (United States)

  • Beat Neuenschwander, Berner Fachhochschule Technik und Informatik (Switzerland)

Program Track Chairs

  • Bo Gu, Bos Photonics (United States)

  • Stefan Kaierle, Laser Zentrum Hannover e.V. (Germany)

Conference Chairs

  • Henry Helvajian, The Aerospace Corporation (United States)

  • Bo Gu, Bos Photonics (United States)

  • Alberto Piqué, U.S. Naval Research Laboratory (United States)

Conference Co-chairs

  • Corey M. Dunsky, Aeos Consulting, Inc. (United States)

  • Jian Liu, PolarOnyx, Inc. (United States)

Conference Program Committee

  • Hongqiang Chen, GE Global Research (United States)

  • John T. Fourkas, University of Maryland, College Park (United States)

  • Youping Gao, Aerojet Rocketdyne (United States)

  • Craig Goldberg, Newport Corporation (United States)

  • Weidong Huang, Northwestern Polytechnical University (China)

  • Yuji Sano, ImPACT (Japan)

  • Michael Thiel, Nanoscribe GmbH (Germany)

  • Paul S. Unwin, Stanmore Implants (United Kingdom)

  • Augustine M. Urbas, Air Force Research Laboratory (United States)

  • Martin Wegener, Karlsruher Institut für Technologie (Germany)

Session Chairs

  • 1 Different Views of Laser 3D Processing

    Henry Helvajian, The Aerospace Corporation (United States)

  • 2 Other Processes with Lasers

    Corey M. Dunsky, Aeos Consulting, Inc. (United States)

  • 3 Microfluidic

    Henry Helvajian, The Aerospace Corporation (United States)

  • 4 Polymers Optical Material 3D

    Martin Wegener, Karlsruher Institut für Technologie (Germany)

  • 5 3D Laser Lithography I: Joint Session with Conferences 10523 and 10544

    Georg von Freymann, Technische Universität Kaiserslautern (Germany)

  • 6 3D Laser Lithography II: Joint Session with Conferences 10523 and 10544

    Frank Scheffold, Université de Fribourg (Switzerland)

  • 7 Special Session: Laser Peening/Cladding

    Yuji Sano, ImPACT (Japan)

    Hongqiang Chen, GE Global Research (United States)

  • 8 Forward Transfer

    Alberto Piqué, U.S. Naval Research Laboratory (United States)

  • 9 Status Additive Technology

    Bo Gu, Bos Photonics (United States)

  • 10 Microprinting

    Michael Thiel, Nanoscribe GmbH (Germany)

  • 11 Metal Processing

    Jian Liu, PolarOnyx, Inc. (United States)

  • 12 New Processes and Process Control I

    Robert Nelson, Air Force Research Laboratory (United States)

  • 13 New Processes and Process Control II

    Henry Helvajian, The Aerospace Corporation (United States)

Introduction

The fifth meeting of Laser 3D Manufacturing at Photonics West 2018 comprised thirteen sessions distributed over four full days of presentations. A joint session with the Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XI Conference provided a technical interchange forum between a community that is fabricating structures with novel materials and a community developing 3D manufacturing processes. The Laser 3D Manufacturing conference also held a special session on laser peening/cladding; a commercially established process which could be incorporated into a laser metal additive process for improving surface finish and material strength/fatigue properties. Also added to the event was a Panel Discussion “3D Printing and Industry 4.0: An Industry Perspective” sponsored by SPIE’s Industry Development Group that had nearly 200 in attendance over a 90-minute segment.

Presentations at the conference included laser 3D fabrication in polymers, glass, metals and composites. Improvements in the processing technology are apparent even over the five years that this meeting has been held, with presentations on qualification and reliability showing data that the industry is coming to grips with the issue by way of process control technology and sensors. However, there are still outstanding issues and some were highlighted at the Industry Panel Discussion:

  • 1) In 3D manufacturing, how can you keep the intellectual property (IP) safe when 3D digital CAD files are transferred across machines and possibly over continents?

  • 2) How can you keep your processing machine from being “hacked” when the tool operates via digital files?

Both are matters of security that must be addressed for 3D manufacturing to become ubiquitous in the production world. While Photonics West is not the forum for digital security, the Laser 3D conference chairs have taken the action item to host a special session on security at the 2019 meeting.

Laser 3D manufacturing appears to be gaining acceptance by an industry that has its sights set not only in the production of simple commodities but also for very high value items such as that used in the aerospace industry. We see the future in the development of new materials for additive manufacturing and in the design and demonstration of 3D structures that have complex properties (e.g. folding).

But first, the community needs to establish process control so repeatability and reliability become “second nature.”

Finally, the conference organizers wish to thank, the PolarOnyx Corporation of San Jose, California (United States) for their sponsorship which allowed the support of students.

Henry Halvajian

Bo Gu

Alberto Piqué

© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter: Volume 10523", Proc. SPIE 10523, Laser 3D Manufacturing V, 1052301 (23 May 2018); doi: 10.1117/12.2322862; https://doi.org/10.1117/12.2322862
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