Here, we present the selective laser melting of pure copper using ultrashort laser pulses. This work involves a comparative study using 500 fs pulses at processing wavelengths of 515 nm and 1030 nm. The repetition rate of the applied laser system was varied within the MHz range in order to exploit heat accumulation. By using the ultrashort interaction times and tailoring the repetition rate, the induced melt pool can be significantly optimized yielding robust copper parts revealing thin-wall structures in the range below 100 μm.
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Lisa Kaden, Gabor Matthäus, Tobias Ullsperger, Brian Seyfarth, Stefan Nolte, "Selective laser melting of copper using ultrashort laser pulses at different wavelengths," Proc. SPIE 10523, Laser 3D Manufacturing V, 1052312 (26 February 2018);