26 February 2018 Solid-state microchip based scanning laser 3D system
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Proceedings Volume 10523, Laser 3D Manufacturing V; 1052317 (2018) https://doi.org/10.1117/12.2295930
Event: SPIE LASE, 2018, San Francisco, California, United States
Abstract
According to the current great interest concerning Large-Scale Metrology applications in many different fields of manufacturing industry, technologies and techniques for dimensional measurement have recently shown a substantial improvement. Ease-of-use, logistic and economic issues, as well as metrological performance, are assuming a more and more important role among system requirements. The project is planned to conduct experimental studies aimed at identifying the impact of the application of the basic laws of chip and microlasers as radiators on the linear-angular characteristics of existing measurement systems. The project is planned to conduct experimental studies aimed at identifying the impact of the application of the basic laws of microlasers as radiators on the linear-angular characteristics of existing measurement systems. The system consists of a distributed network-based layout, whose modularity allows to fit differently sized and shaped working volumes by adequately increasing the number of sensing units. Differently from existing spatially distributed metrological instruments, the remote sensor devices are intended to provide embedded data elaboration capabilities, in order to share the overall computational load.
Conference Presentation
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Egor Kolmakov, Dmitriy Redka, Aleksandr Grishkanich, Ilia Kudashev, Konstantin Tsvetkov, "Solid-state microchip based scanning laser 3D system", Proc. SPIE 10523, Laser 3D Manufacturing V, 1052317 (26 February 2018); doi: 10.1117/12.2295930; https://doi.org/10.1117/12.2295930
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