The PolyPhotonics Berlin consortium targets to address these design challenges and establish a new versatile integration platform combining polymer with Indium-Phosphide and thin-film filter based technologies for numerous photonics applications in the global communications and sensing market. In this paper we will present our methodologies for modelling and prototyping optical elements including hybrid coupling techniques, and compare them with exemplary characterization data obtained from measurements of fabricated devices and test structures. We will demonstrate how the seamless integration between photonic circuit and foundry knowledge enable the rapid virtual prototyping of complex photonic components and integrated circuits.
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A. Polatynski, D. de Felipe, H. Conradi, M. Kresse, A. Richter, S. Mingaleev, E. Sokolov, M. Kleinert, C. Zawadzki, N. Keil, "Virtual prototyping of complex photonic components and integrated circuits for polymer-based integration platform," Proc. SPIE 10536, Smart Photonic and Optoelectronic Integrated Circuits XX, 1053624 (22 February 2018);