22 February 2018 Packaging of silicon photonic devices: from prototypes to production
Author Affiliations +
Proceedings Volume 10537, Silicon Photonics XIII; 105370L (2018) https://doi.org/10.1117/12.2292674
Event: SPIE OPTO, 2018, San Francisco, California, United States
Abstract
The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Padraic E. Morrissey, Kamil Gradkowski, Lee Carroll, Peter O'Brien, "Packaging of silicon photonic devices: from prototypes to production", Proc. SPIE 10537, Silicon Photonics XIII, 105370L (22 February 2018); doi: 10.1117/12.2292674; https://doi.org/10.1117/12.2292674
PROCEEDINGS
6 PAGES


SHARE
Back to Top