22 February 2018 Packaging of silicon photonic devices: from prototypes to production
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Proceedings Volume 10537, Silicon Photonics XIII; 105370L (2018) https://doi.org/10.1117/12.2292674
Event: SPIE OPTO, 2018, San Francisco, California, United States
The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.
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Padraic E. Morrissey, Kamil Gradkowski, Lee Carroll, and Peter O'Brien "Packaging of silicon photonic devices: from prototypes to production", Proc. SPIE 10537, Silicon Photonics XIII, 105370L (22 February 2018); doi: 10.1117/12.2292674; https://doi.org/10.1117/12.2292674

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