22 February 2018 Low-profile fiber connector for co-packaged optics
Author Affiliations +
Proceedings Volume 10538, Optical Interconnects XVIII; 105380S (2018) https://doi.org/10.1117/12.2292086
Event: SPIE OPTO, 2018, San Francisco, California, United States
We developed a small form factor connector that can be assembled on all four sides of a high-data switch package for fiber connectivity. This paper discusses a novel connector approach that has the potential to meet all co-packaging requirements including solder-reflow-compatibility, de-mateability, low insertion loss and state-of-the art FAU attach. The connector was attached to the PIC for performance evaluation. The average insertion loss across all eight fibers of the assembly was 1.77 dB, including the three optical interfaces: (1) MT-to-MT between connector and receptacle, (2) receptacle-to-PLC and (3) PIC-to-FAU. Also included is the propagation loss of the PIC waveguide. Optical return loss was measured to be -55 dB or lower.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lars Brusberg, Lars Brusberg, Michael DeJong, Michael DeJong, Douglas L. Butler, Douglas L. Butler, Jeffrey S. Clark, Jeffrey S. Clark, Clifford G. Sutton, Clifford G. Sutton, } "Low-profile fiber connector for co-packaged optics", Proc. SPIE 10538, Optical Interconnects XVIII, 105380S (22 February 2018); doi: 10.1117/12.2292086; https://doi.org/10.1117/12.2292086

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