29 January 2018 Bend-insensitive optical fiber with high-mechanical reliability for silicon photonic packaging
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Abstract
In this paper, we propose bend insensitive fiber designs that can meet both the bend loss and mechanical reliability needs for silicon photonic packaging. To improve the bend loss, we adopt profile designs with a low index trench that allow us to reduce the bending loss while keeping the mode field diameter compatible with the standard single mode fiber. To improve the mechanical reliability, we put a Titania-doped glass layer on the surface of the fiber cladding, which improves the fiber reliability under tight bending conditions. We describe both the core and Titania layer designs and present results on fiber optical and mechanical performances.
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Ming-Jun Li, Ming-Jun Li, Jeffery Stone, Jeffery Stone, Kevin Bennett, Kevin Bennett, Clifford Sutton, Clifford Sutton, Douglas Butler, Douglas Butler, } "Bend-insensitive optical fiber with high-mechanical reliability for silicon photonic packaging", Proc. SPIE 10559, Broadband Access Communication Technologies XII, 105590M (29 January 2018); doi: 10.1117/12.2299510; https://doi.org/10.1117/12.2299510
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