30 January 2018 High-bandwidth density optically interconnected terabit/s boards
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Abstract
Within the European Project TERABOARD, a photonic integration platforms including electronic-photonic integration is developed to demonstrate high bandwidth high-density modules and to demonstrate cost and energy cost target objectives. Large count high bandwidth density EO interfaces for onboard and intra-data center interconnection are reported. For onboard large count interconnections a novel concept based on optical-TSV interconnection platform with no intersections and no WDM multiplexing is reported. All input/output coupler arrays based on a pluggable silica platform are reported as well.
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Marco Romagnoli, Marco Romagnoli, Gabriele De Angelis, Gabriele De Angelis, Luigi Tallone, Luigi Tallone, Vito Sorianello, Vito Sorianello, Stefano Tirelli, Stefano Tirelli, Bradley Snyder, Bradley Snyder, Peter De Heyn, Peter De Heyn, Yoojin Ban, Yoojin Ban, Lieve Bogaerts, Lieve Bogaerts, Peter Verheyen, Peter Verheyen, Andy Miller, Andy Miller, Joris Van Campenhout, Joris Van Campenhout, Marianna Pantouvaki, Marianna Pantouvaki, Philippe Absil, Philippe Absil, Johan Bauwelinck, Johan Bauwelinck, Xin Yin, Xin Yin, Dries Van Thourhout, Dries Van Thourhout, Joan Juvert Sandez, Joan Juvert Sandez, Roberto Osellame, Roberto Osellame, Rebeca Martínez Vázquez, Rebeca Martínez Vázquez, Diogo P. Lopes, Diogo P. Lopes, Giovanni Battista Preve, Giovanni Battista Preve, Aina A. Serrano Rodrigo, Aina A. Serrano Rodrigo, Paola Galli, Paola Galli, Guido Chiaretti, Guido Chiaretti, Francesco Testa, Francesco Testa, Alberto Bianchi, Alberto Bianchi, Ana Belen Gonzalez, Ana Belen Gonzalez, } "High-bandwidth density optically interconnected terabit/s boards", Proc. SPIE 10560, Metro and Data Center Optical Networks and Short-Reach Links, 105600E (30 January 2018); doi: 10.1117/12.2295897; https://doi.org/10.1117/12.2295897
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