30 January 2018 High-bandwidth density optically interconnected terabit/s boards
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Abstract
Within the European Project TERABOARD, a photonic integration platforms including electronic-photonic integration is developed to demonstrate high bandwidth high-density modules and to demonstrate cost and energy cost target objectives. Large count high bandwidth density EO interfaces for onboard and intra-data center interconnection are reported. For onboard large count interconnections a novel concept based on optical-TSV interconnection platform with no intersections and no WDM multiplexing is reported. All input/output coupler arrays based on a pluggable silica platform are reported as well.
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Marco Romagnoli, Gabriele De Angelis, Luigi Tallone, Vito Sorianello, Stefano Tirelli, Bradley Snyder, Peter De Heyn, Yoojin Ban, Lieve Bogaerts, Peter Verheyen, Andy Miller, Joris Van Campenhout, Marianna Pantouvaki, Philippe Absil, Johan Bauwelinck, Xin Yin, Dries Van Thourhout, Joan Juvert Sandez, Roberto Osellame, Rebeca Martínez Vázquez, Diogo P. Lopes, Giovanni Battista Preve, Aina A. Serrano Rodrigo, Paola Galli, Guido Chiaretti, Francesco Testa, Alberto Bianchi, Ana Belen Gonzalez, "High-bandwidth density optically interconnected terabit/s boards", Proc. SPIE 10560, Metro and Data Center Optical Networks and Short-Reach Links, 105600E (30 January 2018); doi: 10.1117/12.2295897; https://doi.org/10.1117/12.2295897
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