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30 January 2018 High-bandwidth density optically interconnected terabit/s boards
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Abstract
Within the European Project TERABOARD, a photonic integration platforms including electronic-photonic integration is developed to demonstrate high bandwidth high-density modules and to demonstrate cost and energy cost target objectives. Large count high bandwidth density EO interfaces for onboard and intra-data center interconnection are reported. For onboard large count interconnections a novel concept based on optical-TSV interconnection platform with no intersections and no WDM multiplexing is reported. All input/output coupler arrays based on a pluggable silica platform are reported as well.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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