This paper will first discuss alternative techniques and methodologies for detection of lithography-related defects, such as scumming and microbridging. These strategies will then be used to gain a better understanding of the effects of material property changes, process partitioning, and hardware improvements, ultimately correlating them directly with electrical yield detractors .
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Luciana Meli, Karen Petrillo, Anuja De Silva, John Arnold, Nelson Felix, Chris Robinson, Benjamin Briggs, Shravan Matham, Yann Mignot, Jeffrey Shearer, Bassem Hamieh, Koichi Hontake, Lior Huli, Corey Lemley, Dave Hetzer, Eric Liu, Ko Akiteru, Shinichiro Kawakami, Takeshi Shimoaoki, Yusaku Hashimoto, Hiroshi Ichinomiya, Akiko Kai, Koichiro Tanaka, Ankit Jain, Heungsoo Choi, Barry Saville, Chet Lenox, "Defect detection strategies and process partitioning for SE EUV patterning," Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 105830E (28 March 2018);