19 March 2018 EUV photoresist patterning characterization for imec N7/N5 technology
Author Affiliations +
Abstract
In the last year, the continuous efforts on the development of extreme ultraviolet (EUV) lithography has allowed to push the lithographic performance of the EUV photoresists on the ASML NXE:3300 full field exposure tool. Today imec N7 node (equivalent to foundry N5) is the first scaling node at which industry will likely insert EUV into production which will bring a reduction in processing steps therefore reducing total cost of ownership [1], increasing yield and reducing time to ramp. However, the high-volume-manufacturing (HVM) requirement to have a cost-effective low exposure dose photoresist (<20mJ/cm2) remains a big challenge and roughness and pattern defectivity at nano-scale are the major limiting factors of the lithographic process window of EUV resist when looking at tight pitches below 40nm [2, 3].

To be effective during the lithographic EUV material screening phase for such tight pitches, it is necessary to implement complementary metrology analyses that can provide precise information on the resist roughness and a quick feedback on the quantification of nano-failures (nano-bridges, broken lines, merging or missing contacts) induced by a stochastic EUV patterning regime, the random nature of the light-matter interaction and consequent chemical reactions. Beside the traditional approach to characterize a resist with metrics as exposure latitude (EL%), depth of focus (DoF) and line-edge-roughness (LER) based on CDSEM measurements, we have used the power spectra density (PSD) [4] to get an unbiased value of the resist line roughness (LWR and LER) by using Fractilia metroLERTM commercial software. Further, we have used Stochalis imec software [5] to quantify patterning nano failures providing an early stage assessment on the patterning fidelity of the examined resists.

We present the resist characterization results for 32nm dense line-space pattern on different substrates and for 36nm dense and orthogonal contact hole pitch pattern for different photoresists. Two positive tone chemically amplified (CA) resists have been identified at the exposure dose of 45mJ/cm2 and 33mJ/cm2 for logic (pitch 32nm dense line/space) and memory (pitch 36nm dense contact holes) use cases, respectively.
Conference Presentation
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Danilo De Simone, Danilo De Simone, Vito Rutigliani, Vito Rutigliani, Gian Lorusso, Gian Lorusso, Peter De Bisschop, Peter De Bisschop, Yannick Vesters, Yannick Vesters, Victor Blanco Carballo, Victor Blanco Carballo, Geert Vandenberghe, Geert Vandenberghe, } "EUV photoresist patterning characterization for imec N7/N5 technology", Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 105830G (19 March 2018); doi: 10.1117/12.2299504; https://doi.org/10.1117/12.2299504
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