High-resolution EUV lithography using a multi-trigger resist

C. Popescu; D. Kazazis; A. McClelland; G. Dawson; J. Roth; W. Theis; Y. Ekinci; A. P. G. Robinson

doi:10.1117/12.2297406

19 March 2018 High-resolution EUV lithography using a multi-trigger resist

C. Popescu, D. Kazazis, A. McClelland, G. Dawson, J. Roth, W. Theis, Y. Ekinci, A. P. G. Robinson

Proceedings Volume 10583, Extreme Ultraviolet (EUV) Lithography IX; 105831L (2018) https://doi.org/10.1117/12.2297406
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

As minimum lithographic size continues to shrink, the development of techniques and resist materials capable of high resolution, high sensitivity and low line edge roughness (LER) have become increasingly important for next-generation lithography. In this study we present results where the behaviour of the resist is driven towards the multi-trigger regime by manipulating the resist formulation. We also present results obtained after enhancements of the base molecule to give high resolution, better LER, and a significant sensitivity enhancement of 40% over the standard material. Finally, we present the inclusion of non-metallic high-Z elements into the formulation to allow for a further reduction in LER at the same resolution and sensitivity as seen for the enhanced MTR molecule, indicating a direction for further improvements.

Conference Presentation

Citation Download Citation

C. Popescu, D. Kazazis, A. McClelland, G. Dawson, J. Roth, W. Theis, Y. Ekinci, and A. P. G. Robinson "High-resolution EUV lithography using a multi-trigger resist", Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 105831L (19 March 2018); https://doi.org/10.1117/12.2297406

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