10 July 2018 Front Matter: Volume 10584
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10584, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.

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Author(s), “Title of Paper,” in Novel Patterning Technologies 2018, edited by Eric M. Panning, Martha I. Sanchez, Proceedings of SPIE Vol. 10584 (SPIE, Bellingham, WA, 2018) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510616608

ISBN: 9781510616615 (electronic)

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Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Aghili, Ali, 0Q

Ahmad, Ahmad, 06

Alaca, B. Erdem, 06, 1G

Albisetti, E., 05

Allouti, N., 0C

Argoud, M., 0C

Ates, Onur, 1G

Aydogan, Cemal, 06, 1G

Azeredo, Bruno, 0Y

Baskaran, Durairaj, 0N

Bernadac, Arthur, 11

Bertacco, R., 05

Bezik, Cody, 0K

Bicer, Mahmut, 06, 1G

Biolsi, Peter, 08

Blancquaert, Yoann, 0G, 11

Brandt, Pieter, 0G

Breaux, Caleb L., 1H

Brun, Philippe, 11

Budden, Matthias, 06

Bullerjahn, F., 12

Calo, Annalisa, 05

Cayrefourcq, I., 0C

Chalupa, Z., 0C

Chamiot-Maitral, G., 0C

Chang, Chia-Hua, 1E

Chang, Shih-Ming, 1E

Chen, Alex, 1E

Chen, Chien-Cheng, 1E

Chi, Cheng, 0L

Chien, Sheng-Wei, 1C

Choi, Eun Hyuk, 0V, 1F

Choi, Jin, 0Q

Chou, Shuo-Yen, 1E

Claveau, G., 0C

Cohen, Samuel R., 07, 18

Comboroure, C., 0C

Corliss, Daniel, 0L

Dansberg, Michel, 0G

Dazai, Takahiro, 0K

de Boer, Guido, 0G

de Pablo, Juan, 0K

Delly, Evan, 0X

Delony, Jakin B., 1H

Doise, Jan, 0K

Durrani, Zahid, 06

Ehara, Kengo, 1B

Essomba, Philippe, 11

Falvey, Daniel E., 07, 18

Farrell, Richard, 08, 0L

Felix, Nelson, 0L

Fourkas, John T., 07, 17, 18, 19

Fregin, Trevor, 0X

Fröhlich, Thomas, 06

Fuessl, Roland, 06

Fukuhara, Kazuya, 0V

Germain, Allan, 11

Ghosh, Subrata, 09

Glinsner, T., 12

Glodde, Martin, 0L

Gonsalves, Kenneth E., 09

Gronheid, Roel, 0K

Guliyev, Elshad, 06

Guo, Jing, 0L

Gutierrez Razo, Sandra A., 07, 17, 18, 19

Hanabata, Makoto, 15, 16

Hatano, Masayuki, 0V, 1F

Haugabrook, Lynelle, 0X

Hayashi, Tatsuya, 0U

Henderson, Clifford L., 1H

Herfst, Rodolf, 04

Hetzer, David, 0L

Higashiki, Tatsuhiko, 0T

Hiura, Mitsuru, 0Q, 0U

Hofmann, Martin, 06, 1G

Holz, Mathias, 06

Holzner, F., 12

Hsieh, Chia-Yun, 08

Huber, Rebecca P., 0Z

Hutcheson, G. Dan, 0F

Ido, Yasuyuki, 0L, 0M

Im, Ji-Young, 0R

Imoto, Kohei, 0Q

Inada, Hiroshi, 0Q

Inoue, Hideo, 0H

Ishikawa, Masayoshi, 1B

Ivanov, Tzvetan, 06

Iwanaga, Takehiko, 0Q

Jager, Remco, 0G

Jones, Chris, 0Q

Jones, Mervyn, 06

Joo, Yong Lak, 0N

Jung, Wooyung, 0V, 1D, 1F

Kaestner, Marcus, 06

Kato, Hirokazu, 0V, 1F

Khusnatdinov, Niyaz, 0S

Kimura, Atsushi, 0Q, 0U

Kitano, Takahiro, 0M

Ko, Akiteru, 08

Kobayashi, Kei, 0V, 1F

Kobayashi, Sachiko, 0R

Komori, Motofumi, 0R, 1D

Kono, Takuya, 0R, 0V, 1D, 1F

Kuehnel, Michael, 06

Kulmala, T. S., 12

Kurosawa, Tsuyoshi, 0K

Lai, Kafai, 0L

Landis, Stéfan, 0G, 11

Lee, Chien-Lin, 1C

Lenk, Claudia, 06, 1G

Lenk, Steve, 06

Liaros, Nikolaos, 07, 17, 18, 19

Liu, Chi-Chun, 0L

Liu, Chun-Hung, 1E

Liu, Eric, 08

Liu, Ru-Gun, 1E

Liu, Weijun, 0S

Liverman, Nicholas, 0X

Lo, Wen, 1E

Ludovice, Peter J., 1H

Manske, E., 06

Matsumoto, Hiroshi, 0H

Matsumoto, Yoko, 15

Matsumura, Yuushi, 1B

Maturova, Klara, 04

McCoy, Jake, 0Z

Metz, Andrew, 0L

Mignot, Yann, 0L

Miura, Ichihiro, 1B

Mizui, Kento, 16

Mizuno, Makoto, 0Q

Mohtashami, Abbas, 04

Moinuddin, Mohamad Ghulam, 09

Moore, N. Collin, 0X

Mullin, Amy S., 07, 18, 19

Muramatsu, Makoto, 0L, 0M

Nakagawa, Hiroki, 1B

Nakajima, Shinya, 15, 16

Nakamura, Takayuki, 1F

Nakasugi, Tetsuro, 0R, 0V, 1D, 1F

Navarro, C., 0C

Navarro, Violeta, 04

Nealey, Paul F., 0K

Niauzorau, Stanislau, 0Y

Nicolet, C., 0C

Nishi, Takanori, 0M

Oehrlein, Gottlieb S., 07, 18

Ogden, Hannah M., 07, 18, 19

Ohtoshi, Kenji, 0H

O’Meara, David, 08

Paans, Manuel, 0Z

Pain, Laurent, 0C,0G

Peijster, Jerry, 0G

Petersen, John S., 07, 17, 18, 19

Petti, D., 05

Pimenta-Barros, Patricia, 0C, 11

Pinge, Shubham, 0N

Piras, Daniele, 04

Posseme, N., 0C

Pradeep, Chullikkattil P., 09

Pradelles, Jonathan, 0G, 11

Pranda, Adam, 07, 18

Rademaker, Guido, 0G

Rangelow, Ivo W., 06, 1G

Rawlings, C. D., 12

Reddy, Pulikanti Guruprasad, 09

Ren, Jiaxing, 0K

Reum, Alexander, 06

Reuter, Christoph, 06

Riedo, E., 05

Rincon-Delgadillo, Paulina, 0K

Sadeghian, Hamed, 04

Sakai, Tatsuya, 1B

Sato, Chiaki, 0Q

Schleunitz, A., 12

Segal-Peretz, Tamar, 0K

Sekiguchi, Atsushi, 15

Servin, Isabelle, 0G, 11

Sha, Jing, 0L Sharma, Satinder K., 09

Sharstniou, Aliaksandr, 0Y

Shy, Shyi-Long, 13

Slot, Erwin, 0G

Spieser, M., 12

Stachowiak, Tim, 0S

Steenbrink, Stijn, 0G

Sugino, Naoto, 15

Suzaki, Yoshio, 0U

Suzuki, Masato, 0V

Takanashi, Kazunori, 1B

Takei, Satoshi, 14, 15, 16

Tamura, Takao, 0H

ten Berge, Gerard, 11

Thum, Matthew, 07

Tiron, R., 0C

Tokue, Hiroshi, 0V, 1F

Tomova, Zuleykhan, 07, 17

Torun, Hamdi, 1G

Tsai, Kuen-Yu, 1C

Tsuda, Hirotaka, 0R, 1D

van Brakel, Remco, 0Z

van Es, Maarten, 04

Verschuuren, Marc A., 0Z

Volland, Burkhard, 1G

Voorkamp, Rob, 0Z

Washida, Kazuhiro, 0R, 1D

Wieland, Marco, 0G, 11

Wolf, Steven M., 07, 18

Wu, Hsin-Wei, 1E

Yalcinkaya, Arda D., 1G

Yamamoto, Kiyohito, 0Q

Yamashita, Hiroshi, 0H

Yamashita, Kyoji, 0R

Yamazaki, Akiyoshi, 0K

You, Gen, 0M

Zheng, Xiaorui, 05

Zhou, Chun, 0K

Zöllner, Jens-Peter, 06

Conference Committee

Symposium Chair

  • Bruce W. Smith, Rochester Institute of Technology (United States)

Symposium Co-chair

  • Will Conley, Cymer, An ASML Company (United States)

Conference Chair

  • Eric M. Panning, Intel Corporation (United States)

Conference Co-chair

  • Martha I. Sanchez, IBM Research - Almaden (United States)

Conference Program Committee

  • Chris Bencher, Applied Materials, Inc. (United States)

  • Alan D. Brodie, KLA-Tencor Corporation (United States)

  • Kenneth R. Carter, University of Massachusetts Amherst (United States)

  • Juan J. de Pablo, The University of Chicago (United States)

  • Richard A. Farrell, TEL Technology Ctr., America, LLC (United States)

  • Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)

  • Daniel J. C. Herr, The University of North Carolina at Greensboro (United States)

  • Tatsuhiko Higashiki, Toshiba Corporation (Japan)

  • Erik R. Hosler, GLOBALFOUNDRIES Inc. (United States)

  • J. Alexander Liddle, National Institute of Standards and Technology (United States)

  • Shy-Jay Lin, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

  • Chi-Chun Liu, IBM Corporation (United States)

  • Hans Loeschner, IMS Nanofabrication GmbH (Austria)

  • John G. Maltabes, Applied Materials GmbH & Company KG (United States)

  • Laurent Pain, CEA-LETI (France)

  • Ivo W. Rangelow, Technische University Ilmenau (Germany)

  • Douglas J. Resnick, Canon Nanotechnologies, Inc. (United States)

  • Ricardo Ruiz, HGST (United States)

  • Chandrasekhar Sarma, Intel Corporation (United States)

  • Frank M. Schellenberg, Consultant (United States)

  • Helmut Schift, Paul Scherrer Institut (Switzerland)

  • Ines A. Stolberg, Vistec Electron Beam GmbH (Germany)

  • Hsinyu Tsai, IBM Thomas J. Watson Research Center (United States)

  • Kevin T. Turner, University of Pennsylvania (United States)

  • Marco J. Wieland, MAPPER Lithography (Netherlands)

  • Wei Wu, The University of Southern California (United States)

Session Chairs

  • 1 Keynote Session

    Eric M. Panning, Intel Corporation (United States)

    Martha I. Sanchez, IBM Research - Almaden (United States)

  • 2 Invited Session: Scanning Probe Patterning

    Chandrasekhar Sarma, Intel Corporation (United States)

    Richard A. Farrell, TEL Technology Ctr., America, LLC (United States)

  • 3 Novel Lithography and Alternative Patterning I

    Ivo W. Rangelow, Technische University Ilmenau (Germany) Marco Wieland, MAPPER Lithography (Netherlands)

  • 4 Self-Assembly

    Ricardo Ruiz, Western Digital (United States)

    Laurent Pain, CEA-LETI (France)

  • 5 E-beam Lithography

    Ines A. Stolberg, Vistec Electron Beam GmbH (Germany)

    Hans Loeschner, IMS Nanofabrication GmbH (Austria)

  • 6 DSA Materials and Characterization: Joint Session with Conferences 10586 and 10584

    Ralph R. Dammel, EMD Performance Materials Corporation (United States)

    Chi-Chun Liu, IBM Corporation (United States)

  • 7 DSA Materials and Integration: Joint Session with Conferences 10586 and 10584

    Daniel Sanders, IBM Research - Almaden (United States)

    J. Alexander Liddle, National Institute of Standards and Technology (United States)

  • 8 Nanoimprint Lithography Masks and Systems

    Tatsuhiko Higashiki, Toshiba Memory Corporation (Japan)

    John G. Maltabes, Applied Materials GmbH & Company KG (United States)

  • 9 Nanoimprint Lithography for High Volume Manufacturing

    Douglas J. Resnick, Canon Nanotechnologies, Inc. (United States)

    Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)

  • 10 Novel Lithography and Alternative Patterning II and 3D Patterning Methods

    Eric M. Panning, Intel Corporation (United States)

    Martha I. Sanchez, IBM Research - Almaden (United States)

  • 11 Novel Lithography and Alternative Patterning III

    Eric R. Hosler, Global Foundries (United States)

    Martha I. Sanchez, IBM Research - Almaden (United States)

© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 10584", Proc. SPIE 10584, Novel Patterning Technologies 2018, 1058401 (10 July 2018); doi: 10.1117/12.2325244; https://doi.org/10.1117/12.2325244
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