28 March 2018 The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
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Abstract
The progress of using DSA for metal cut to achieve sub-20nm tip-to-tip (t2t) critical dimension (CD) is reported. Small and uniform t2t CD is very challenging due to lithographic limitation but holds the key to backend-of-the-line (BEOL) scaling. An integration scheme is demonstrated that allows the combination of design flexibility and fine, rectified local CD uniformity (LCDU). The combined effect of LCDU and centroid jittering will be discussed and compared to a hole shrink process using atomic layer deposition and spacer formation. The learning from this case study can provide perspectives that may not have been investigated thoroughly in the past. By including more important elements during DSA process development, such as metal cut, the DSA maturit y can be further advanced and move DSA closer to HVM adoption.
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Chi-Chun Liu, Yann Mignot, Cheng Chi, Richard Farrell, Kafai Lai, Jing Guo, Jing Sha, Martin Glodde, Makoto Muramatsu, Yasuyuki Ido, Nelson Felix, David Hetzer, Andrew Metz, Daniel Corliss, "The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD", Proc. SPIE 10584, Novel Patterning Technologies 2018, 105840L (28 March 2018); doi: 10.1117/12.2297365; https://doi.org/10.1117/12.2297365
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