In this paper, we review the advancements in the wafer imprinting system. To address high volume manufacturing concerns, an FPA-1200NZ2C four-station cluster tool is used in order to meet throughput and cost of ownership requirements (CoO). Throughputs of up to 90 wafers per hour were achieved by applying a multi-field dispense method. Mask like of up to 81 lots, using a contact test mask were demonstrated. The status of the tool overlay is discussed. Application of a High Order Distortion Correction (HODC) system to the existing magnification actuator has enabled correction of high order distortion terms up to K30. A mix and match overlay of 3.4 nm has been demonstrated and a single machine overlay across the wafer was 2.5nm.
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Mitsuru Hiura, Tatsuya Hayashi, Atsushi Kimura, Yoshio Suzaki, "Overlay improvements using a novel high-order distortion correction system for NIL high-volume manufacturing," Proc. SPIE 10584, Novel Patterning Technologies 2018, 105840U (19 March 2018);