Paper
19 March 2018 Thin films for high-resolution, 3-color lithography
Author Affiliations +
Abstract
Three-color lithography (3CL) can produce high-resolution features using visible light. This technique uses one beam to pre-activate a photoresist, a second beam to deactivate it, and a third beam to activate the pre-activated regions that have not been deactivated. The deactivation beam is used to trim features, allowing for improved feature size and resolution. Although this 3CL was pioneered with 2-photon excitation, the ultimate goal is to use thin films with linear excitation, such that it is compatible with industrial requirements. We will discuss the first thin-film 3CL studies, which are a promising step towards large-area patterning.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sandra A. Gutierrez Razo, Adam Pranda, Nikolaos Liaros, Samuel R. Cohen, John T. Fourkas, Gottlieb S. Oehrlein, Hannah M. Ogden, Amy Mullin, Steven M. Wolf, Daniel Falvey, and John Petersen "Thin films for high-resolution, 3-color lithography", Proc. SPIE 10584, Novel Patterning Technologies 2018, 1058418 (19 March 2018); https://doi.org/10.1117/12.2299681
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KEYWORDS
Thin films

Lithography

Semiconducting wafers

Photoresist materials

Silicon

Etching

Optical lithography

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