Metrology, Inspection, and Process Control for Microlithography XXXII
Proceedings Volume 10585 is from: Logo
25 February - 1 March 2018
San Jose, California, United States
Optical Metrology
Proc. SPIE 10585, Extensibility of optics-based metrology for sub-5nm technology (Conference Presentation), 1058504 (); doi: 10.1117/12.2301076
Proc. SPIE 10585, Scatterometry for gate all around (GAA) technology enablement (Conference Presentation), 1058505 (); doi: 10.1117/12.2300972
Proc. SPIE 10585, Muller matrix spectroscopic ellipsometry based scatterometry simulations of Si and Si/SixGe1-x/Si/SixGe1-x/Si fins for sub-7nm node gate-all-around transistor metrology (Conference Presentation), 1058506 (); doi: 10.1117/12.2296988
Proc. SPIE 10585, Study of µDBO overlay target size reduction for application broadening, 1058507 (13 March 2018); doi: 10.1117/12.2297673
Proc. SPIE 10585, Defect inspection using a time-domain mode decomposition technique, 1058508 (13 March 2018); doi: 10.1117/12.2297443
Proc. SPIE 10585, High-throughput defect inspection for arbitrarily shaped EUV absorber patterns (Conference Presentation), 1058509 (); doi: 10.1117/12.2297587
Proc. SPIE 10585, Optimizing defect detectability across multiple ultraviolet wavelengths (Conference Presentation), 105850A (); doi: 10.1117/12.2301188
Proc. SPIE 10585, Contact inspection of Si nanowire with SEM voltage contrast, 105850B (13 March 2018); doi: 10.1117/12.2296992
Proc. SPIE 10585, Through-focus scanning optical microscopy (TSOM) with adaptive optics, 105850C (13 March 2018); doi: 10.1117/12.2282527
Proc. SPIE 10585, The need for line-edge roughness metrology standardization: the imec protocol (Conference Presentation), 105850D (); doi: 10.1117/12.2294617
Proc. SPIE 10585, Line-width roughness of advanced semiconductor features by using FIB and planar-TEM as reference metrology, 105850E (22 March 2018); doi: 10.1117/12.2296463
Proc. SPIE 10585, Programmed LWR metrology by multi-techniques approach, 105850F (13 March 2018); doi: 10.1117/12.2292169
Proc. SPIE 10585, CD-SEM algorithm optimization for line roughness metrology (Conference Presentation), 105850G (); doi: 10.1117/12.2297426
Proc. SPIE 10585, Measurement of pattern roughness and local size variation using CD-SEM: current status , 105850H (13 March 2018); doi: 10.1117/12.2299633
Challenges and New Methods
Proc. SPIE 10585, 7/5nm logic manufacturing capabilities and requirements of metrology, 105850I (22 March 2018); doi: 10.1117/12.2296679
Proc. SPIE 10585, Extraction of CDs and side wall angles from top down SEM images of double layered structures (Conference Presentation), 105850K (); doi: 10.1117/12.2298389
New Methods: Student Session
Proc. SPIE 10585, Complex EUV imaging reflectometry: spatially-resolved 3D composition determination and dopant profiling with a tabletop 13nm source, 105850M (13 March 2018); doi: 10.1117/12.2297464
Proc. SPIE 10585, Characterization and imaging of nanostructured materials using tabletop extreme ultraviolet light sources, 105850N (13 March 2018); doi: 10.1117/12.2297223
Proc. SPIE 10585, Image-based overlay measurement using subsurface ultrasonic resonance force microscopy, 105850O (13 March 2018); doi: 10.1117/12.2302959
Proc. SPIE 10585, EUV-angle resolved scatter (EUV-ARS): a new tool for the characterization of nanometre structures, 105850P (13 March 2018); doi: 10.1117/12.2297195
Proc. SPIE 10585, X-ray EM simulation tool for ptychography dataset construction, 105850Q (13 March 2018); doi: 10.1117/12.2297200
Overlay News
Proc. SPIE 10585, Image-based overlay and alignment metrology through optically opaque media with sub-surface probe microscopy, 105850R (13 March 2018); doi: 10.1117/12.2299956
Proc. SPIE 10585, Holistic metrology qualification extension and its application to characterize overlay targets with asymmetric effects, 105850T (13 March 2018); doi: 10.1117/12.2297184
Proc. SPIE 10585, Overlay and stitching metrology for massively parallel electron-beam lithography (Conference Presentation), 105850U (22 March 2018); doi: 10.1117/12.2297535
Proc. SPIE 10585, A unique method for controlling device level overlay with high-NA optical overlay technique using YieldStar in a DRAM HVM environment, 105850V (13 March 2018); doi: 10.1117/12.2297094
Hybrid Metrology and Machine Learning
Proc. SPIE 10585, CD-SEM real time bias correction using reference metrology based modeling, 105850W (13 March 2018); doi: 10.1117/12.2297065
Proc. SPIE 10585, Implementation of machine learning for high-volume manufacturing metrology challenges (Conference Presentation), 105850X (21 March 2018); doi: 10.1117/12.2300167
Proc. SPIE 10585, Deep machine learning based Image classification in hard disk drive manufacturing (Conference Presentation), 105850Y (); doi: 10.1117/12.2300952
Proc. SPIE 10585, Novel hybrid metrology for process integration of gate all around (GAA) devices (Conference Presentation), 105850Z (); doi: 10.1117/12.2297500
Proc. SPIE 10585, In-line characterization of non-selective SiGe nodule defects with scatterometry enabled by machine learning (Conference Presentation), 1058510 (); doi: 10.1117/12.2297377
Proc. SPIE 10585, Lines roughness holistic metrology sensitivity study supported by EUV mask designed with induced roughness (Conference Presentation), 1058511 (); doi: 10.1117/12.2297265
New Methods and Machine Learning
Proc. SPIE 10585, Pursuing the critical dimension in etched patterns using x-ray scattering, 1058512 (13 March 2018); doi: 10.1117/12.2297518
Proc. SPIE 10585, Context-based virtual metrology, 1058514 (22 March 2018); doi: 10.1117/12.2302498
Proc. SPIE 10585, Predicting back-end writer main pole shape geometry from wafer metrology data in hard disk drive manufacturing (Conference Presentation), 1058515 (); doi: 10.1117/12.2301325
Proc. SPIE 10585, High repeatability CD-SEM metrology of disk drive writer and extraction of SWA (Conference Presentation), 1058516 (); doi: 10.1117/12.2301328
Proc. SPIE 10585, Modeling of electron-specimen interaction in scanning electron microscope for e-beam metrology and inspection: challenges and perspectives, 1058517 (13 March 2018); doi: 10.1117/12.2301383
Proc. SPIE 10585, Model improvements to simulate charging in SEM, 1058518 (13 March 2018); doi: 10.1117/12.2297478
Proc. SPIE 10585, Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layers, 1058519 (16 March 2018); doi: 10.1117/12.2298408
Proc. SPIE 10585, Influence of e-beam aperture angle on CD-SEM measurements for high-aspect ratio structure, 105851A (13 March 2018); doi: 10.1117/12.2296756
Proc. SPIE 10585, Yield impact for wafer shape misregistration-based binning for overlay APC diagnostic enhancement, 105851B (16 March 2018); doi: 10.1117/12.2302973
Proc. SPIE 10585, Approaches of multilayer overlay process control for 28nm FD-SOI derivative applications, 105851C (13 March 2018); doi: 10.1117/12.2292446
Proc. SPIE 10585, In cell OVL metrology by using optical metrology tool, 105851D (13 March 2018); doi: 10.1117/12.2300946
Proc. SPIE 10585, Matching between simulations and measurements as a key driver for reliable overlay target design, 105851E (13 March 2018); doi: 10.1117/12.2297011
Proc. SPIE 10585, Multi-wavelength approach towards on-product overlay accuracy and robustness, 105851F (13 March 2018); doi: 10.1117/12.2297420
Design Interactions: Joint session with conferences 10585 and 10588
Proc. SPIE 10585, Advanced combined overlay and CD uniformity measurement mark for double patterning, 105851H (13 March 2018); doi: 10.1117/12.2299299
Proc. SPIE 10585, Enabling optical metrology on small 5x5um2 in-cell targets to support flexible sampling and higher order overlay and CD control for advanced logic devices nodes, 105851I (13 March 2018); doi: 10.1117/12.2297356
Proc. SPIE 10585, Spectroscopic vector analysis for fast pattern quality monitoring, 105851J (13 March 2018); doi: 10.1117/12.2296448
Process Control News
Proc. SPIE 10585, Setting up a proper power spectral density (PSD) and autocorrelation analysis for material and process characterization (Conference Presentation), 105851K (); doi: 10.1117/12.2297264
Proc. SPIE 10585, Holistic approach for overlay and edge placement error to meet the 5nm technology node requirements, 105851L (13 March 2018); doi: 10.1117/12.2297283
Proc. SPIE 10585, A novel patterning control strategy based on real-time fingerprint recognition and adaptive wafer level scanner optimization, 105851N (13 March 2018); doi: 10.1117/12.2297304