7/5nm logic manufacturing capabilities and requirements of metrology

Benjamin Bunday; A. F. Bello; Eric Solecky; Alok Vaid

doi:10.1117/12.2296679

22 March 2018 7/5nm logic manufacturing capabilities and requirements of metrology

Benjamin Bunday, A. F. Bello, Eric Solecky, Alok Vaid

Proceedings Volume 10585, Metrology, Inspection, and Process Control for Microlithography XXXII; 105850I (2018) https://doi.org/10.1117/12.2296679
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

This paper will provide an update to previous works [2][4][9] to our view of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic technology for foundries. First, we will review of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. We will then update the industry’s progress towards addressing gating technical limits of the most important of these metrology solutions, highlighting key metrology technology gaps requiring industry attention and investment.

Conference Presentation

Citation Download Citation

Benjamin Bunday, A. F. Bello, Eric Solecky, and Alok Vaid "7/5nm logic manufacturing capabilities and requirements of metrology", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850I (22 March 2018); https://doi.org/10.1117/12.2296679

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