13 March 2018 A new way of measuring wiggling pattern in SADP for 3D NAND technology
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Abstract
A new metrology method of quantitatively measuring wiggling patterns in a Self-Aligned Double Patterning (SADP) process for 2D NAND technology has been developed with a CD-SEM metrology program on images from a Review-SEM system. The metrology program provided accurate modeling of various wiggling patterns. The Review-SEM system provided a-few-micrometer-wide Field of View (FOV), which exceeds precision-guaranteed FOV of a conventional CD-SEM. The result has been effectively verified by visual inspection on vertically compressed images compared with Wiggling Index from this new method. A best-known method (BKM) system has been developed with connected HW and SW to automatically measure wiggling patterns.
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Jian Mi, Ziqi Chen, Li Ming Tu, Xiaoming Mao, Gong Cai Liu, Hiroki Kawada, "A new way of measuring wiggling pattern in SADP for 3D NAND technology", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105852S (13 March 2018); doi: 10.1117/12.2297249; https://doi.org/10.1117/12.2297249
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