13 March 2018 In-depth analysis and characterization of a dual damascene process with respect to different CD
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Abstract
In a 200 mm high volume environment, we studied data from a dual damascene process. Dual damascene is a combination of lithography, etch and CMP that is used to create copper lines and contacts in one single step. During these process steps, different metal CD are measured by different measurement methods. In this study, we analyze the key numbers of the different measurements after different process steps and develop simple models to predict the electrical behavior* . In addition, radial profiles have been analyzed of both inline measurement parameters and electrical parameters. A matching method was developed based on inline and electrical data. Finally, correlation analysis for radial signatures is presented that can be used to predict excursions in electrical signatures.
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Gerd Krause, Gerd Krause, Detlef Hofmann, Detlef Hofmann, Boris Habets, Boris Habets, Stefan Buhl, Stefan Buhl, Manuela Gutsch, Manuela Gutsch, Alberto Lopez-Gomez, Alberto Lopez-Gomez, Wan-Soo Kim, Wan-Soo Kim, Xaver Thrun, Xaver Thrun, } "In-depth analysis and characterization of a dual damascene process with respect to different CD", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105852T (13 March 2018); doi: 10.1117/12.2302971; https://doi.org/10.1117/12.2302971
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