13 March 2018 Automated AFM for small-scale and large-scale surface profiling in CMP applications
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Abstract
As the feature size is shrinking in the foundries, the need for inline high resolution surface profiling with versatile capabilities is increasing. One of the important areas of this need is chemical mechanical planarization (CMP) process. We introduce a new generation of atomic force profiler (AFP) using decoupled scanners design. The system is capable of providing small-scale profiling using XY scanner and large-scale profiling using sliding stage. Decoupled scanners design enables enhanced vision which helps minimizing the positioning error for locations of interest in case of highly polished dies. Non-Contact mode imaging is another feature of interest in this system which is used for surface roughness measurement, automatic defect review, and deep trench measurement. Examples of the measurements performed using the atomic force profiler are demonstrated.
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Ardavan Zandiatashbar, Byong Kim, Young-kook Yoo, Keibock Lee, Ahjin Jo, Ju Suk Lee, Sang-Joon Cho, Sang-il Park, "Automated AFM for small-scale and large-scale surface profiling in CMP applications", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105852U (13 March 2018); doi: 10.1117/12.2297521; https://doi.org/10.1117/12.2297521
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