22 March 2018 7/5nm logic manufacturing capabilities and requirements of metrology
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Abstract
This paper will provide an update to previous works [2][4][9] to our view of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic technology for foundries. First, we will review of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. We will then update the industry’s progress towards addressing gating technical limits of the most important of these metrology solutions, highlighting key metrology technology gaps requiring industry attention and investment.
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Benjamin Bunday, Benjamin Bunday, A. F. Bello, A. F. Bello, Eric Solecky, Eric Solecky, Alok Vaid, Alok Vaid, "7/5nm logic manufacturing capabilities and requirements of metrology", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850I (22 March 2018); doi: 10.1117/12.2296679; https://doi.org/10.1117/12.2296679
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