Front Matter: Volume 10586
Proc. SPIE 10586, Front Matter: Volume 10586, 1058601 (11 May 2018); https://doi.org/10.1117/12.2323987
EUV: Resist Processes: Joint session with conferences 10583 and 10586
Proc. SPIE 10586, Aqueous developers for positive tone ultrathin chemically amplified EUV resists, 1058604 (28 March 2018); https://doi.org/10.1117/12.2297380
Proc. SPIE 10586, EUV via hole pattern fidelity enhancement through novel resist and post-litho plasma treatment, 1058605 (13 March 2018); https://doi.org/10.1117/12.2297661
EUV: Metal-based Resists: Joint session with conferences 10583 and 10586
Proc. SPIE 10586, Surface characterization of tin-based inorganic EUV resists, 1058607 (13 March 2018); https://doi.org/10.1117/12.2297484
Proc. SPIE 10586, Mechanisms of photodecomposition of metal-containing EUV photoresists: isotopic labelling studies, 1058608 (27 March 2018); https://doi.org/10.1117/12.2298418
Materials and Etch Integration: Joint session with conferences 10586 and 10589
Proc. SPIE 10586, The challenge of multi-patterning lithography for contact layer in 7nm and beyond (Conference Presentation), 105860B (); https://doi.org/10.1117/12.2297504
EUV: Fundamentals
Proc. SPIE 10586, Unraveling the role of photons and electrons upon their chemical interaction with photoresist during EUV exposure, 105860C (19 March 2018); https://doi.org/10.1117/12.2299593
Proc. SPIE 10586, Polymer effects on PAG acid yield in EUV resists, 105860D (21 March 2018); https://doi.org/10.1117/12.2297692
Proc. SPIE 10586, Characterization of metal resist for EUV lithography using Infrared free electron laser, 105860E (13 March 2018); https://doi.org/10.1117/12.2297156
Proc. SPIE 10586, Investigations on EUVL metal resist dissolution behavior using in situ high-speed atomic force microscopy, 105860F (13 March 2018); https://doi.org/10.1117/12.2294585
EUV: Novel Processes
Proc. SPIE 10586, Study of electron beam and extreme ultraviolet resist utilizing polarity change and radical crosslinking, 105860H (13 March 2018); https://doi.org/10.1117/12.2297392
Proc. SPIE 10586, LWR enhancement for 300mm track processing, 105860J (13 March 2018); https://doi.org/10.1117/12.2297471
Proc. SPIE 10586, Novel Sn-based photoresist for high aspect ratio patterning, 105860K (13 March 2018); https://doi.org/10.1117/12.2297440
Hardmasks and Underlayer
Proc. SPIE 10586, New spin on carbon materials made from hemicellulose for hardmask layer, 105860M (28 March 2018); https://doi.org/10.1117/12.2297333
Proc. SPIE 10586, High-carbon fullerene based spin-on organic hardmask, 105860N (13 March 2018); https://doi.org/10.1117/12.2297453
DSA Materials and Characterization: Joint session with conferences 10586 and 10584
Proc. SPIE 10586, A progress report on DSA of high-chi silicon containing block co-polymers (Conference Presentation), 105860O (); https://doi.org/10.1117/12.2299966
Proc. SPIE 10586, Utilization of metal-polymer interactions for self-aligned directed self-assembly of device relevant features, 105860P (17 April 2018); https://doi.org/10.1117/12.2300859
Proc. SPIE 10586, Pillars fabrication by DSA lithography: material and process options, 105860Q (19 March 2018); https://doi.org/10.1117/12.2297414
DSA: Defectivity and High-chi
Proc. SPIE 10586, Impact of annealing temperature on DSA process: toward faster assembly kinetics (Conference Presentation), 105860T (); https://doi.org/10.1117/12.2299496
Proc. SPIE 10586, A simulation study on bridge defects in lamellae-forming diblock copolymers, 105860U (13 March 2018); https://doi.org/10.1117/12.2297287
Proc. SPIE 10586, Directed self-assembly of triblock copolymers for sub-10 nm nanofabrication using polymeric additives, 105860V (19 March 2018); https://doi.org/10.1117/12.2296857
Proc. SPIE 10586, Straightforward directed self-assembly process flows enabled by advanced materials, 105860W (13 March 2018); https://doi.org/10.1117/12.2297013
DSA: Cylinder Forming BCP and Metrology
Proc. SPIE 10586, Characterizing the internal structure of BCP filled contact holes with critical dimension small angle x-ray scattering (Conference Presentation), 105860X (); https://doi.org/10.1117/12.2297480
Proc. SPIE 10586, Xylan block copolymer for wide-range directed self-assembly lithography enabling wider range of 3D patterning size (Conference Presentation), 105860Y (); https://doi.org/10.1117/12.2297334
Proc. SPIE 10586, Automated lamellar block copolymer process characterization , 105860Z (19 March 2018); https://doi.org/10.1117/12.2297347
Proc. SPIE 10586, DSA process characterization using BSE metrology (Conference Presentation), 1058610 (); https://doi.org/10.1117/12.2299634
Novel Processes
Proc. SPIE 10586, Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control, 1058612 (13 March 2018); https://doi.org/10.1117/12.2297360
Proc. SPIE 10586, Resist-polymer ablation by mid-infrared-free-electron laser, 1058613 (13 March 2018); https://doi.org/10.1117/12.2297163
Proc. SPIE 10586, High-precision 3D printing as a versatile tool for integrated photonics (Conference Presentation), 1058614 (); https://doi.org/10.1117/12.2297404
Proc. SPIE 10586, Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NILTM process through surface and defectivity characterizations, 1058615 (13 March 2018); https://doi.org/10.1117/12.2298407
Poster Session: Filtration
Proc. SPIE 10586, Application specific ratings of filters for negative-tone developer, 1058616 (13 March 2018); https://doi.org/10.1117/12.2297164
Proc. SPIE 10586, The intrinsic role of membrane morphology to reduce defectivity in advanced photochemicals, 1058617 (13 March 2018); https://doi.org/10.1117/12.2297389
Proc. SPIE 10586, Targeted removal of metallic contamination from lithography solvents using membrane purifiers, 1058618 (13 March 2018); https://doi.org/10.1117/12.2297395
Proc. SPIE 10586, Improved airborne molecular contaminant filter performance for photolithography, 105861A (13 March 2018); https://doi.org/10.1117/12.2297034
Poster Session: DSA
Proc. SPIE 10586, Directed Self-Assembly (DSA) for contact applications, 105861D (13 March 2018); https://doi.org/10.1117/12.2303492
Proc. SPIE 10586, Fast annealing DSA materials designed for sub-5 nm resolution, 105861E (13 March 2018); https://doi.org/10.1117/12.2307288
Poster Session: Novel Processes
Proc. SPIE 10586, Desirable material selection on self-aligned multi-patterning, 105861F (13 March 2018); https://doi.org/10.1117/12.2297297
Proc. SPIE 10586, Synthesis of metal nanoparticle and patterning in polymeric films induced by electron beam, 105861G (13 March 2018); https://doi.org/10.1117/12.2297331
Proc. SPIE 10586, Mechanism study of ion implantation on photoresist shrinkage, 105861H (13 March 2018); https://doi.org/10.1117/12.2297367
Proc. SPIE 10586, Chemical trimming overcoat: an advanced composition and process for photoresist enhancement in lithography, 105861I (13 March 2018); https://doi.org/10.1117/12.2307674
Poster Session: Underlayer and Hardmask
Proc. SPIE 10586, Development of new polyphenols applied to spin-on carbon hardmask with characteristics of high-heat resistance and good planarization, 105861K (13 March 2018); https://doi.org/10.1117/12.2297289
Proc. SPIE 10586, Effects of fluorine contamination on spin-on dielectric thickness in semiconductor manufacturing, 105861M (13 March 2018); https://doi.org/10.1117/12.2297309
Poster Session: EUV
Proc. SPIE 10586, Investigating the threshold electron energy for reactions in EUV resist materials, 105861N (28 March 2018); https://doi.org/10.1117/12.2297386
Proc. SPIE 10586, Nanoscale inhomogeneity and photoacid generation dynamics in extreme ultraviolet resist materials, 105861O (13 March 2018); https://doi.org/10.1117/12.2316308