Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control

Sohan Singh Mehta; Marco Yeung; Fahad Mirza; Thiagarajan Raman; Travis Longenbach; Justin Morgan; Mark Duggan; Rio A. Soedibyo; Sean Reidy; Mohamed Rabie; Jae Kyu Cho; C. S. Premachandran; Danish Faruqui

doi:10.1117/12.2297360

13 March 2018 Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control

Sohan Singh Mehta, Marco Yeung, Fahad Mirza, Thiagarajan Raman, Travis Longenbach, Justin Morgan, Mark Duggan, Rio A. Soedibyo, Sean Reidy, Mohamed Rabie, Jae Kyu Cho, C. S. Premachandran, Danish Faruqui

Author Affiliations +

Proceedings Volume 10586, Advances in Patterning Materials and Processes XXXV; 1058612 (2018) https://doi.org/10.1117/12.2297360
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate ~45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.

Conference Presentation

Citation Download Citation

Sohan Singh Mehta, Marco Yeung, Fahad Mirza, Thiagarajan Raman, Travis Longenbach, Justin Morgan, Mark Duggan, Rio A. Soedibyo, Sean Reidy, Mohamed Rabie, Jae Kyu Cho, C. S. Premachandran, and Danish Faruqui "Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control", Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058612 (13 March 2018); https://doi.org/10.1117/12.2297360

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available