13 March 2018 Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control
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Abstract
In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate ~45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.
Conference Presentation
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Sohan Singh Mehta, Marco Yeung, Fahad Mirza, Thiagarajan Raman, Travis Longenbach, Justin Morgan, Mark Duggan, Rio A. Soedibyo, Sean Reidy, Mohamed Rabie, Jae Kyu Cho, C. S. Premachandran, Danish Faruqui, "Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control", Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058612 (13 March 2018); doi: 10.1117/12.2297360; https://doi.org/10.1117/12.2297360
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