13 March 2018 Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control
Author Affiliations +
Abstract
In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate ~45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sohan Singh Mehta, Sohan Singh Mehta, Marco Yeung, Marco Yeung, Fahad Mirza, Fahad Mirza, Thiagarajan Raman, Thiagarajan Raman, Travis Longenbach, Travis Longenbach, Justin Morgan, Justin Morgan, Mark Duggan, Mark Duggan, Rio A. Soedibyo, Rio A. Soedibyo, Sean Reidy, Sean Reidy, Mohamed Rabie, Mohamed Rabie, Jae Kyu Cho, Jae Kyu Cho, C. S. Premachandran, C. S. Premachandran, Danish Faruqui, Danish Faruqui, } "Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control", Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058612 (13 March 2018); doi: 10.1117/12.2297360; https://doi.org/10.1117/12.2297360
PROCEEDINGS
13 PAGES + PRESENTATION

SHARE
Back to Top