13 March 2018 Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NILTM process through surface and defectivity characterizations
Author Affiliations +
Abstract
In this work, an evaluation of various ASL processes for 200 mm wafer scale in the HERCULES® NIL equipment platform available at the CEA-Leti through the INSPIRE program is reported. The surface and adherence energies were correlated to the AFM and defectivity results in order to select the most promising ASL process for high resolution etch mask applications. The ASL performances of the selected process were evaluated by multiple working stamp fabrication using unpatterned and patterned masters though defectivity monitoring on optical based-inspection tools. Optical and SEM defect reviews were systematically performed. Multiple working stamps fabrication without degradation of the master defectivity was witnessed. This evaluation enabled to benchmark several ASL solutions based on the grafted technology develop by ARKEMA in order to reduce and optimize the soft stamp defectivity prior to its replication and therefore considerably reduce the final imprint defectivity for the Smart NIL process.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
F. Delachat, F. Delachat, J.-C. Phillipe, J.-C. Phillipe, V. Larrey, V. Larrey, F. Fournel, F. Fournel, S. Bos, S. Bos, H. Teyssèdre , H. Teyssèdre , Xavier Chevalier, Xavier Chevalier, Célia Nicolet, Célia Nicolet, Christophe Navarro, Christophe Navarro, Ian Cayrefourcq, Ian Cayrefourcq, } "Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NILTM process through surface and defectivity characterizations", Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058615 (13 March 2018); doi: 10.1117/12.2298407; https://doi.org/10.1117/12.2298407
PROCEEDINGS
8 PAGES


SHARE
RELATED CONTENT


Back to Top