20 March 2018 Cross-platform (NXE-NXT) machine-to-machine overlay matching supporting next node chip manufacturing
Author Affiliations +
Abstract
EUV lithography enables the transition from multiple patterning in DUV back to single patterning in EUV, with the associated cost benefit. While imaging and patterning becomes easier with EUV, cross-platform overlay performance needs to be taken into account.

With quadruple patterning, the matching performance is driven by the platform capabilities, with platform specific fingerprints not contributing to the matching performance as they are similar for each layer. Introducing EUV automatically means we need to compensate for the differences in the platform fingerprints, as they bring a penalty in the DUV-EUV matching budget.

This paper will explain what the main overlay contributors in cross-platform matched machine overlay are and how they can be cancelled or reduced using additional correction measures, with the goal to reach below 2.0 nm cross matched machine overlay.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Theo Thijssen, Theo Thijssen, Marcel Beckers, Marcel Beckers, Albert Mollema, Albert Mollema, Leon Levasier, Leon Levasier, Alexander Padi, Alexander Padi, Chia-Wei Hung, Chia-Wei Hung, Hsiao-Lan Chen, Hsiao-Lan Chen, Laurens van Bokhoven, Laurens van Bokhoven, Niels Lammers, Niels Lammers, Jean Phillippe van Damme, Jean Phillippe van Damme, Floris Teeuwisse, Floris Teeuwisse, Robin Tijssen, Robin Tijssen, Wilson Tzeng, Wilson Tzeng, Cathy Wang, Cathy Wang, Marcel Mastenbroek, Marcel Mastenbroek, Harald Vos, Harald Vos, Ting-Ju Yueh, Ting-Ju Yueh, Miao-Chi Chen , Miao-Chi Chen , Hsueh-Hung Wu, Hsueh-Hung Wu, Shin-Rung Peng, Shin-Rung Peng, Chun-Kuang Chen, Chun-Kuang Chen, L. J. Chen , L. J. Chen , Kevin Cheng, Kevin Cheng, John Lin, John Lin, } "Cross-platform (NXE-NXT) machine-to-machine overlay matching supporting next node chip manufacturing", Proc. SPIE 10587, Optical Microlithography XXXI, 1058709 (20 March 2018); doi: 10.1117/12.2297387; https://doi.org/10.1117/12.2297387
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