20 March 2018 Cross-platform (NXE-NXT) machine-to-machine overlay matching supporting next node chip manufacturing
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Abstract
EUV lithography enables the transition from multiple patterning in DUV back to single patterning in EUV, with the associated cost benefit. While imaging and patterning becomes easier with EUV, cross-platform overlay performance needs to be taken into account.

With quadruple patterning, the matching performance is driven by the platform capabilities, with platform specific fingerprints not contributing to the matching performance as they are similar for each layer. Introducing EUV automatically means we need to compensate for the differences in the platform fingerprints, as they bring a penalty in the DUV-EUV matching budget.

This paper will explain what the main overlay contributors in cross-platform matched machine overlay are and how they can be cancelled or reduced using additional correction measures, with the goal to reach below 2.0 nm cross matched machine overlay.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Theo Thijssen, Marcel Beckers, Albert Mollema, Leon Levasier, Alexander Padi, Chia-Wei Hung, Hsiao-Lan Chen, Laurens van Bokhoven, Niels Lammers, Jean Phillippe van Damme, Floris Teeuwisse, Robin Tijssen, Wilson Tzeng, Cathy Wang, Marcel Mastenbroek, Harald Vos, Ting-Ju Yueh, Miao-Chi Chen , Hsueh-Hung Wu, Shin-Rung Peng, Chun-Kuang Chen, L. J. Chen , Kevin Cheng, John Lin, "Cross-platform (NXE-NXT) machine-to-machine overlay matching supporting next node chip manufacturing", Proc. SPIE 10587, Optical Microlithography XXXI, 1058709 (20 March 2018); doi: 10.1117/12.2297387; https://doi.org/10.1117/12.2297387
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