Presentation + Paper
20 March 2018 Overlay control for 7nm technology node and beyond
Nyan Aung, Woong Jae Chung, Pavan Samudrala, Haiyong Gao, Wenle Gao, Darius Brown, Guanchen He, Bono Park, Michael Hsieh, Xueli Hao, Yen-Jen Chen, Yue Zhou, DeNeil Park, Karsten Gutjahr, Ian Krumanocker, Kevin Jock, Juan Manuel Gomez
Author Affiliations +
Abstract
We demonstrate high volume manufacturing feasibility of 7 nm technology overlay correction requirement. This stateof- the-art overlay control is achieved by (i) overlay sampling optimization and advanced modeling, (ii) alignment and advanced process control optimization, (iii) multiple target overlay optimization, and (iv) heating control. We will also discuss further improvements in overlay control for 7 nm technology node and beyond including computational metrology, extreme ultraviolet and optic tools overlay matching control, high order alignment correction, tool stability improvement, and advanced heating control.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nyan Aung, Woong Jae Chung, Pavan Samudrala, Haiyong Gao, Wenle Gao, Darius Brown, Guanchen He, Bono Park, Michael Hsieh, Xueli Hao, Yen-Jen Chen, Yue Zhou, DeNeil Park, Karsten Gutjahr, Ian Krumanocker, Kevin Jock, and Juan Manuel Gomez "Overlay control for 7nm technology node and beyond", Proc. SPIE 10587, Optical Microlithography XXXI, 105870A (20 March 2018); https://doi.org/10.1117/12.2295828
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Overlay metrology

Semiconducting wafers

Optical alignment

Reticles

High volume manufacturing

Metrology

HVAC controls

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