20 March 2018 Sub-micron lines patterning into silica using water developable chitosan bioresist films for eco-friendly positive tone e-beam and UV lithography
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Abstract
Biopolymers represent natural, renewable and abundant materials. Their use is steadily growing in various areas (food, health, building …) but, in lithography, despite some works, resists, solvents and developers are still oil-based and hazardous chemicals. In this work, we replaced synthetic resist by chitosan, a natural, abundant and hydrophilic polysaccharide. High resolution sub-micron patterns were obtained through chitosan films as water developable, chemically unmodified, positive tone mask resist for an eco-friendly electron beam and deep-UV (193 nm) lithography process. Sub-micron patterns were also successfully obtained using a 248 nm photomasker thanks to the addition of biosourced photoactivator, riboflavin. Patterns were then transferred by plasma etching into silica even for high resolution patterns.
Conference Presentation
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Mathieu Caillau, Céline Chevalier, Pierre Crémillieu, Thierry Delair, Olivier Soppera, Benjamin Leuschel, Cédric Ray, Christophe Moulin, Christian Jonin, Emmanuel Benichou, Pierre-François Brevet, Christelle Yeromonahos, Emmanuelle Laurenceau, Yann Chevolot, Jean-Louis Leclercq, "Sub-micron lines patterning into silica using water developable chitosan bioresist films for eco-friendly positive tone e-beam and UV lithography ", Proc. SPIE 10587, Optical Microlithography XXXI, 105870S (20 March 2018); doi: 10.1117/12.2292312; https://doi.org/10.1117/12.2292312
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