14 May 2018 Front Matter: Volume 10588
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10588, including the Title Page, Copyright information, Table of Contents, introduction (if any), and Conference Committee listing.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

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Author(s), “Title of Paper,” in Design-Process-Technology Co-optimization for Manufacturability XII, edited by Jason P. Cain, Chi-Min Yuan, Proceedings of SPIE Vol. 10588 (SPIE, Bellingham, WA, 2018) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510616684

ISBN: 9781510616691 (electronic)

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Paper Numbering: Proceedings of SPIE follow an e-First publication model. A unique citation identifier (CID) number is assigned to each article at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Authors

Numbers in the index correspond to the last two digits of the six-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first four digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Abe, Yayori, 0I

Ahmad Ibrahim, Muhamad Asraf Bin, 0V

Ali, Rehab Kotb, 0P, 0Q

Asthana, Abhishek, 06

Baert, R., 03

Bakshi, Janam, 0F

Batarseh, Fadi, 0F

Baum, Z., 08

Berekovic, M., 03

Blanco, Victor, 0N

Bonnecaze, Roger, 0G

Boudaa, F., 07

Brown, William, 0T

Cain, Jason P., 05, 0F

Cantù, Pietro, 0S

Cao, Liang, 06

Catarisano, Chiara, 0S

Chae, Jung Kyu, 09

Chanemougame, D., 08

Chartoire, J., 07

Chava, Bharani, 0B

Chen, Han, 0W

Chen, James C.-H., 04

Chen, Jian, 0D

Chen, Kao-Tun, 10

Chen, Yi-Chieh, 10

Chen, Ying, 11

Cheng, Jing, 06

Chopra, Meghali, 0G

Chu, Zhihao, 0W

Corneo, Nicoletta, 0S

Debacker, Peter, 03, 09, 0B, 0N

Delachat, F., 07

Deng, Guogui, 0U

Dick, Gregory J., 06

Du, Chunshan, 0U, 0W, 0X, 0Y, 0Z

Dundulachi, Alessandro, 0S

ElManhawy, Wael, 0U

Elsemary, Ahmed Mounir, 0F

Facchini, M., 08

Fakhry, Moutaz, 05, 0F

Fatehy, Ahmed Hamed, 0P, 0Q

Gai, Tianyang, 11

Gao, Gensheng, 0U

Gao, Shaowen, 0K

Gennari, Frank, 05

Gerousis, V., 03, 08, 09

Gillijns, Werner, 0N

Gu, Tingting, 0W

Gupta, Puneet, 0O

Han, G., 08

Helpert, Sofia, 0G

Hu, Xinyi, 0U, 0W, 0X, 0Y, 0Z

Huang, Elven, 0Z

Huang, Lucas, 0X, 0Z

Hurat, Philippe, 0L, 0V, 10

Hyun, Daijoon, 0R

Ismail, Mohamed, 0F

Jung, Jinwook, 0A, 0R

Kabeel, Aliaa, 0U

Kajiwara, Masanari, 0I

Kamal Baharin, Ezni Aznida Binti, 0V

Kan, Huan, 0X, 0Z

Kim, Ryoung-Han, 03, 09, 0N

Kotani, Toshiya, 0I

Kwan, Joe, 0U

Lai, Ya-Chieh, 05, 0D, 0L, 0V, 10

Lee, Jae Uk, 0N

Lee, Robben, 0Y

Lee, Tyzy, 0Y

Lee, Zhao Chuan, 0E, 0J

Li, Helen, 0Y

Li, Shuai, 0D

Li, Tsung-Han, 10

Li, Yongfu, 0E, 0J

LiCausi, Nicholas V., 04

Liebmann, L., 08

Lin, Eason, 0D

Lin, Hung-Yu, 10

Lippincott, George, 0T

Litterio, Emma, 0S

Liu, Hermes, 0Y

Liu, Zhengfang, 0U, 0W, 0X, 0Y, 0Z

Liubich, Vlad, 0T

Luo, Yandong, 0O

Lupa, Paul, 0L

Ma, Yuansheng, 0K

Madhavan, Sriram, 0C

Madkour, Kareem, 0U

Malik, Arindam, 0N

Mantovani, Valeria, 0S

Mattii, Luca, 03, 09, 0B

May, M., 07

McIntyre, Greg, 0N

Milojevic, D., 03

Mocuta, A., 09

Mohyeldin, Ahmed, 0F

Muhsain, Mohamad Fahmi Bin, 0V

Muirhead, Jonathan, 0Z

Nakajima, Fumiharu, 0I

Nakamoto, N., 08

Nojima, Shigeki, 0I

Northrop, G., 08

Ong, Jonathan Yoong Seang, 0E, 0J

Ou, Odie, 0D

Patelmo, Matteo, 0S

Pathak, Piyush, 05

Perez, Valerio, 0E, 0J

Perraud, L., 07

Power, David N., 06

Qu, Shengrui, 0D

Quemere, P., 07

Raghavan, Praveen, 03, 09, 0N

Riviere-Cazaux, L., 08

Ronse, Kurt, 0N

Ryan, E. Todd, 04

Ryckaert, Julien, 03, 09, 0B, 0N

Schroeder, Uwe Paul, 0F

Seo, Jaewoo, 0A

Shah, Nishant, 0F

Shang, Shumay, 0K

Sherazi, Syed Muhammad Yasser, 03, 09, 0B, 0N

Shin, Youngsoo, 0A, 0R

Smith, R. S., 04

Song, Youngsoo, 0R

Spessot, Alessio, 09, 0B

Su, Xiaojing, 11

Su, Yajuan, 11

Sun, K., 08

Sun, Yuyang, 0K

Sweis, Jason, 05, 0L, 0V

Tan, Ling Ee, 0N

Teyssedre, H., 07

Tripathi, Vikas, 0E, 0J

Triulzi, Benedetta, 0S

Tseng, I-Lun, 0E, 0J

Verkest, Diederik, 03, 09, 0B, 0N

Verma, Rahul, 0G

Wan, Qijian, 0U, 0W, 0X, 0Y, 0Z

Wang, Jun, 0D

Wang, Lynn T.-N., 0C

Wang, Mudan, 0U

Wang, Ruoping, 0L

Watanabe, Yuki, 0I

Wei, Alexander, 0K

Wei, Fang, 0W

Wei, Yayi, 11

Word, James, 0P, 0Q

Wu, Chun-Sheng, 10

Wu, Hall, 0Y

Wu, Rui, 0K, 0T

Xu, Wei, 0D

Xue, Teddy, 0Y

Yang, Legender, 0X, 0Z

Ye, Tianchun, 11

Yin, Lianghong, 0K

Yu, Shirui, 0U

Zhang, Chenming, 0W

Zhang, Hongxin, 0K

Zhang, Meili, 0U

Zhang, Recoo, 0Z

Zhang, Zizhuo, 0G

Zhu, ChengYu, 0D

Zhu, Jun, 0W

Zhu, Xilan, 0G

Zhu, Yu, 0Z

Zou, Elaine, 0X, 0Z

Conference Committee

Symposium Chair

  • Bruce W. Smith, Rochester Institute of Technology (United States)

Symposium Co-chair

  • Will Conley, Cymer, An ASML company (United States)

Conference Chair

  • Jason P. Cain, Advanced Micro Devices, Inc. (United States)

Conference Co-chair

  • Chi-Min Yuan, NXP Semiconductors (United States)

Conference Program Committee

  • Robert Aitken, ARM Inc. (United States)

  • Luigi Capodieci, KnotPrime Inc. (United States)

  • Lifu Chang, Qualcomm Inc. (United States)

  • Ryoung-Han Kim, IMEC (Belgium)

  • Neal V. Lafferty, Mentor Graphics Corporation (United States)

  • Ya-Chieh Lai, Cadence Design Systems, Inc. (United States)

  • Lars W. Liebmann, GLOBALFOUNDRIES Inc. (United States)

  • Ru-Gun Liu, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

  • Andrew R. Neureuther, University of California, Berkeley (United States)

  • Shigeki Nojima, Toshiba Corporation (Japan)

  • David Z. Pan, The University of Texas at Austin (United States)

  • Chul-Hong Park, SAMSUNG Electronics Company, Ltd. (Korea, Republic of)

  • Michael L. Rieger, Consultant (United States)

  • Vivek K. Singh, Intel Corporation (United States)

  • Lynn T. Wang, GLOBALFOUNDRIES Inc. (United States)

Session Chairs

  • 1 Trends in DPTCO

    Jason P. Cain, Advanced Micro Devices, Inc. (United States)

    Chi-Min Yuan, NXP Semiconductors (United States)

  • 2 Pattern Correction Methods: Joint Session with Conferences 10588 and 10587

    Neal V. Lafferty, Mentor, a Siemens Business (United States)

    Carlos Fonseca, Tokyo Electron America, Inc. (United States)

  • 3 Design-Technology Co-optimization

    Ru-Gun Liu, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

    Vivek K. Singh, Intel Corporation (United States)

  • 4 Layout Optimization

    Luigi Capodieci, KnotPrime, Inc. (United States)

    Michael L. Rieger, Consultant (United States)

  • 5 Design Interactions: Joint Session with Conferences 10585 and 10588

    John C. Robinson, KLA-Tencor Corporation (United States)

    Ryoung-Han Kim, imec (Belgium)

  • 6 Pattern-based Analysis

    Lifu Chang, Qualcomm Inc. (United States)

    Lars W. Liebmann, GLOBALFOUNDRIES Inc. (United States)

  • 7 Advanced Patterning

    Shigeki Nojima, Toshiba Corporation (Japan)

    Lynn T.-N. Wang, GLOBALFOUNDRIES Inc. (United States)

© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter: Volume 10588", Proc. SPIE 10588, Design-Process-Technology Co-optimization for Manufacturability XII, 1058801 (14 May 2018); doi: 10.1117/12.2324886; https://doi.org/10.1117/12.2324886
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