20 March 2018 Pattern analysis and classification accelerates OPC tuning, monitoring, and optimization and mask inspection
Author Affiliations +
Abstract
Advances in pattern-based layout tools enable automatic and rapid capture, tailoring, creation, classification, and comparison/matching (accurate or fuzzy) of large quantities of patterns. Applications of such tools have significantly improved traditional script- or manual- based approaches, and have produced impressive results in production OPC and mask work. In this work, we introduce into NXP mask preparation a flow with pattern-matching-assisted mask data inspection solution, employing Cadence Pattern Analysis (CPA) tool. We also engage in CPA-facilitated creation of pattern libraries to achieve more comprehensive results in more automatic ways than what could be realized with traditional approaches, and utilize these patterns to accelerate OPC tuning, monitoring, and optimization.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ruoping Wang, Paul Lupa, Jason Sweis, Ya-Chieh Lai, Philippe Hurat, "Pattern analysis and classification accelerates OPC tuning, monitoring, and optimization and mask inspection", Proc. SPIE 10588, Design-Process-Technology Co-optimization for Manufacturability XII, 105880L (20 March 2018); doi: 10.1117/12.2297097; https://doi.org/10.1117/12.2297097
PROCEEDINGS
14 PAGES


SHARE
RELATED CONTENT


Back to Top