20 March 2018 Advanced process and defect characterization methodology to support process development of advanced patterning structures
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Abstract
This paper discusses the approach and solution adopted by GLOBALFOUNDRIES, a high volume manufacturing (HVM) foundry, for dry-etch related edge-signature surface particle defects issue facing the sub-nm node in the gate-etch sector. It is one of the highest die killers for the company in the 14-nm node. We have used different approaches to attack and rectify the edge signature surface particle defect. Several process-related & hardware changes have been successively implemented to achieve defect reduction improvement by 63%. Each systematic process and/or hardware approach has its own unique downstream issues and they have been dealt in a route-cause-effect technique to address the issue.
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Supriya Ketkar, Supriya Ketkar, Junhan Lee, Junhan Lee, Sen Asokamani, Sen Asokamani, Winston Cho, Winston Cho, Shailendra Mishra, Shailendra Mishra, "Advanced process and defect characterization methodology to support process development of advanced patterning structures", Proc. SPIE 10589, Advanced Etch Technology for Nanopatterning VII, 105890F (20 March 2018); doi: 10.1117/12.2297451; https://doi.org/10.1117/12.2297451
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