17 April 2018 EUV patterning using CAR or MOX photoresist at low dose exposure for sub 36nm pitch
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The semiconductor industry has been pushing the limits of scalability by combining 193nm immersion lithography with multi-patterning techniques for several years. Those integrations have been declined in a wide variety of options to lower their cost but retain their inherent variability and process complexity. EUV lithography offers a much desired path that allows for direct print of line and space at 36nm pitch and below and effectively addresses issues like cycle time, intra-level overlay and mask count costs associated with multi-patterning. However it also brings its own sets of challenges. One of the major barrier to high volume manufacturing implementation has been hitting the 250W power exposure required for adequate throughput [1]. Enabling patterning using a lower dose resist could help move us closer to the HVM throughput targets assuming required performance for roughness and pattern transfer can be met.

As plasma etching is known to reduce line edge roughness on 193nm lithography printed features [2], we investigate in this paper the level of roughness that can be achieved on EUV photoresist exposed at a lower dose through etch process optimization into a typical back end of line film stack. We will study 16nm lines printed at 32 and 34nm pitch. MOX and CAR photoresist performance will be compared. We will review step by step etch chemistry development to reach adequate selectivity and roughness reduction to successfully pattern the target layer.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sophie Thibaut, Sophie Thibaut, Angélique Raley, Angélique Raley, Frederic Lazarrino, Frederic Lazarrino, Ming Mao, Ming Mao, Danilo De Simone, Danilo De Simone, Daniele Piumi , Daniele Piumi , Kathy Barla, Kathy Barla, Akiteru Ko, Akiteru Ko, Andrew Metz, Andrew Metz, Kaushik Kumar, Kaushik Kumar, Peter Biolsi, Peter Biolsi, "EUV patterning using CAR or MOX photoresist at low dose exposure for sub 36nm pitch", Proc. SPIE 10589, Advanced Etch Technology for Nanopatterning VII, 105890M (17 April 2018); doi: 10.1117/12.2300355; https://doi.org/10.1117/12.2300355

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