19 February 2018 Low reflection and field localization over surface plasmon device with subwavelength patterned aluminum film
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Proceedings Volume 10607, MIPPR 2017: Multispectral Image Acquisition, Processing, and Analysis; 1060706 (2018) https://doi.org/10.1117/12.2286302
Event: Tenth International Symposium on Multispectral Image Processing and Pattern Recognition (MIPPR2017), 2017, Xiangyang, China
Abstract
In this paper, we propose a new device composed of patterned sub-wavelength arrays to investigate surface plasmons (SPs) over sub-wavelength metal nano-structures. The device consists of silicon substrate and sub-wavelength patterns fabricated on a layer of aluminum film with nanometer thickness. Each sub-wavelength pattern formed in aluminum film is composed of a basic nano-square and twelve triangles for shaping single nano-pattern, which are uniformly distributed on the four sides of each square. Reflectance spectra and electric field distribution in infrared region are simulated. Numerical simulation results demonstrate that the device can efficiently lower its reflectance in infrared spectrum, and the response frequency can be controlled by only changing the device parameters such as square side length and then triangle vertex angle. Besides, the simulated electric field distribution of the device shows obviously field localization effect at the edges of aluminum film nano-structure. The electric filed around the tips of aluminum triangles is localized into sub-wavelength scale, so as to be beyond the common diffraction limitation. Our work will help to reveal the interesting properties of SPs device, and also bring new prospect of photonic device.
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Ying Yuan, Ying Yuan, Sha Peng, Sha Peng, Huabao Long, Huabao Long, Runhan Liu, Runhan Liu, Dong Wei, Dong Wei, Xinyu Zhang, Xinyu Zhang, Haiwei Wang, Haiwei Wang, Changsheng Xie, Changsheng Xie, } "Low reflection and field localization over surface plasmon device with subwavelength patterned aluminum film", Proc. SPIE 10607, MIPPR 2017: Multispectral Image Acquisition, Processing, and Analysis, 1060706 (19 February 2018); doi: 10.1117/12.2286302; https://doi.org/10.1117/12.2286302
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