19 December 2017 Feature extraction of the wafer probe marks in IC packaging
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Proceedings Volume 10613, 2017 International Conference on Robotics and Machine Vision; 1061308 (2017) https://doi.org/10.1117/12.2299924
Event: Second International Conference on Robotics and Machine Vision, 2017, Kitakyushu, Japan
Abstract
This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.
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Cheng-Yu Tsai, Cheng-Yu Tsai, Chia-Te Lin, Chia-Te Lin, Chen-Ting Kao, Chen-Ting Kao, Chau-Shing Wang, Chau-Shing Wang, } "Feature extraction of the wafer probe marks in IC packaging", Proc. SPIE 10613, 2017 International Conference on Robotics and Machine Vision, 1061308 (19 December 2017); doi: 10.1117/12.2299924; https://doi.org/10.1117/12.2299924
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