Paper
12 January 2018 Parallelism measurement for base plate of standard artifact with multiple tactile approaches
Author Affiliations +
Abstract
Nowadays, as workpieces become more precise and more specialized which results in more sophisticated structures and higher accuracy for the artifacts, higher requirements have been put forward for measuring accuracy and measuring methods. As an important method to obtain the size of workpieces, coordinate measuring machine (CMM) has been widely used in many industries. In order to achieve the calibration of a self-developed CMM, it is found that the parallelism of the base plate used for fixing the standard artifact is an important factor which affects the measurement accuracy in the process of studying self-made high-precision standard artifact. And aimed to measure the parallelism of the base plate, by using the existing high-precision CMM, gauge blocks, dial gauge and marble platform with the tactile approach, three methods for parallelism measurement of workpieces are employed, and comparisons are made within the measurement results. The results of experiments show that the final accuracy of all the three methods is able to reach micron level and meets the measurement requirements. Simultaneously, these three approaches are suitable for different measurement conditions which provide a basis for rapid and high-precision measurement under different equipment conditions.
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Xiuling Ye, Yan Zhao, Yiwen Wang, Zhong Wang, Luhua Fu, and Changjie Liu "Parallelism measurement for base plate of standard artifact with multiple tactile approaches", Proc. SPIE 10621, 2017 International Conference on Optical Instruments and Technology: Optoelectronic Measurement Technology and Systems, 106211C (12 January 2018); https://doi.org/10.1117/12.2294963
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KEYWORDS
Error analysis

Distance measurement

Manufacturing

3D modeling

Composites

Mathematical modeling

Standards development

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