14 May 2018 Development of a hermetically packaged 13μm pixel pitch 6000-element InGaAs linear array
Author Affiliations +
Abstract
In this paper, we present the test results of a flight-grade 13μm pixel pitch 6000-element 1.7μm InGaAs linear array in a hermetic package, designed and developed for space remote sensing and imaging applications. The array consists of a single 13μm pixel pitch 6000-element InGaAs linear array and a custom single digital 2.0 Mecapacitance trans-impedance amplifier (CTIA) readout integrated circuit (ROIC) with four gains. We have achieved greater than 80% peak quantum efficiency and higher than 1100 signal-to-noise ratio (SNR) at 90% well fill. The focal plane array is in a vacuum hermatically sealed package with an anti-reflective (AR)-coated Sapphire window and 29 pins, including four for low voltage differential signaling (LVDS) outputs.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kai Song, Kai Song, Jih-Fen Lei, Jih-Fen Lei, Anders Peterson, Anders Peterson, Henry Yuan, Henry Yuan, Jongwoo Kim, Jongwoo Kim, Joe Kimchi, Joe Kimchi, Vincent Douence, Vincent Douence, Brian Starr, Brian Starr, Venkataraman Sundareswaran, Venkataraman Sundareswaran, James W. Beletic, James W. Beletic, } "Development of a hermetically packaged 13μm pixel pitch 6000-element InGaAs linear array", Proc. SPIE 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V, 106560K (14 May 2018); doi: 10.1117/12.2305374; https://doi.org/10.1117/12.2305374
PROCEEDINGS
8 PAGES + PRESENTATION

SHARE
RELATED CONTENT


Back to Top