14 May 2018 Hemispherical image sensor development for wide FOV imaging
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Abstract
Curved image sensors offer a new degree of freedom in optical system design that promise low-cost, small-volume solutions for wide field-of-view imaging. Stretchable polymer backplanes can provide the high-density of interconnects and tolerate the large deformations needed to transform planar, wafer-based image sensors into shapes with large nonzero Gaussian curvature. Here we demonstrate a thermoformable backplane based on glycolated polyethylene terephthalate (PETg) that can be deformed to a 98° spherical cap with 0.5” radius. We introduce a process to integrate such backplanes with a CMOS image sensor and release the circuit from the wafer to form a monolithically integrated image sensor that can be thermoformed to the desired shape.
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Zhao Ma, Zhao Ma, C. Kyle Renshaw, C. Kyle Renshaw, "Hemispherical image sensor development for wide FOV imaging", Proc. SPIE 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V, 106561Q (14 May 2018); doi: 10.1117/12.2305051; https://doi.org/10.1117/12.2305051
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